Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.

Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract: An adhesive composition, having: a polyalkylene oxide-added polyfunctional epoxy compound (a) represented by formula (A); a polyfunctional (meth)acrylate monomer (b), and a photo-acid generator (c); a method of bonding the adherends and a method of producing a stack, each of which uses the same: wherein R designates a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); X designates a divalent linking group having a ring structure and 6 to 20 carbon atoms, or a lower alkylene group (e.g. an alkylene group having 1 to 4 carbon atoms); and m and n each are 0, or a positive number, independently.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of —O—, —S—, —CO—, and —NH—, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

Abstract: A curable and hygroscopic resin composition for sealing electronic devices, having at least a (meth)acrylate oligomer (a) having the number-average molecular weight of 1,500 to 5,000, a low molecular weight (meth)acrylate (b) having an average molecular weight of 170 to 500, a moisture-reactive organometallic compound (c), and a polymerization initiator (d), wherein the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b) are multifunctional (meth)acrylates in which the number of (meth)acryloyl groups is from 1.5 to 3 in one molecule of each of the (meth)acrylate oligomer (a) and the low molecular weight (meth)acrylate (b); a sealing resin; and an electronic device.

Abstract: An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand: M(ORx)n??Formula (1) wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M. wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Abstract: A resin composition for sealing an electronic device and other things being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth)acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group, and at least one organic group represented by chemical formula (2) is included within chemical formula (1); l and m each represent 0 or 1; n represents an integer of 15-150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract: A resin composition for sealing an electronic device and other things being capable of sealing an electronic device without trapping air and being capable of suppressing the permeation of water vapor is provided. The present invention includes a polybutadiene polymer represented by chemical formula (1) and having a (meth) acryloyl group at a terminal end; and a photopolymerization initiator, and does not include a thermoplastic resin having a mass-average molecular weight of 50,000 or more: wherein R1 and R2 each represent a hydroxyl group or H2C?C(R7)—COO—; R3 and R4 each represent a C1-C16 substituted or unsubstituted, non-N-containing divalent organic group; R5, R6 and R7 each represent a hydrogen atom or a C1-C10 alkyl group; l and m each represent 0 or 1; n represents an integer from 15 to 150; and x:y=0 to 100:100 to 0; R1 and R2 are never both a hydroxyl group.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M—Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.

Abstract: A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a organometallic compound and a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 20,000, and an iodine value less than 40 g/100 g, and having no polar group, wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon being heated at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.