Patents by Inventor Yasushi Isono

Yasushi Isono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230150230
    Abstract: Provided is a nonwoven fabric and a laminated nonwoven fabric suitable as the skin material of a composite sound-absorbing material. The nonwoven fabric and laminated nonwoven fabric are easily formable, thin, and lightweight and excel in form stability, and can nevertheless be controlled within a given range of aeration after being formed into shape. A nonwoven fabric having a laminate structure in which at least one ultra-fine fiber layer (M) having an average fiber diameter of 0.3 to 7 ?m (inclusive) and a basis weight of 1 g/m2 to 40 g/m2 (inclusive) and at least one continuous filament layer (S) having an average fiber diameter of 10 to 30 ?m (inclusive) are integrated together by partial thermocompression bonding.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Shinya Yamamuro, Rumina Obi, Kazufumi Kato, Tomoya Tanaka, Chie Okamura, Yasushi Isono, Junki Saito
  • Publication number: 20200316906
    Abstract: Provided is a nonwoven fabric and a laminated nonwoven fabric suitable as the skin material of a composite sound-absorbing material. The nonwoven fabric and laminated nonwoven fabric are easily formable, thin, and lightweight and excel in form stability, and can nevertheless be controlled within a given range of aeration after being formed into shape. A nonwoven fabric having a laminate structure in which at least one ultra-fine fiber layer (M) having an average fiber diameter of 0.3 to 7 ?m (inclusive) and a basis weight of 1 g/m2 to 40 g/m2 (inclusive) and at least one continuous filament layer (S) having an average fiber diameter of 10 to 30 ?m (inclusive) are integrated together by partial thermocompression bonding.
    Type: Application
    Filed: December 13, 2018
    Publication date: October 8, 2020
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Shinya Yamamuro, Rumina Obi, Kazufumi Kato, Tomoya Tanaka, Chie Okamura, Yasushi Isono, Junki Saito