Abstract: A semiconductor wafer according to the present embodiment is a semiconductor wafer having a first face. A plurality of chip structures are provided on a plurality of chip regions of the first face. A test structure is provided on dicing regions between adjacent ones of the chip regions. The chip structures each comprise first integrated circuits provided on the semiconductor wafer, and a first stacked body provided above the first integrated circuits and including a plurality of first layers and a plurality of second layers different from the first layers alternately stacked. The test structure comprises second integrated circuits provided on the semiconductor wafer, and a second stacked body provided above the second integrated circuits and including the first layers and the second layers alternately stacked.

Abstract: A semiconductor storage device includes first and second chips. The first chip includes memory cells provided on a first substrate in a memory cell region, a plurality of first pads provided on a first surface of the first substrate and disposed in an edge region of the first chip that surrounds the memory cell region, and a first conductive layer provided on the first substrate and electrically connected to the first pads. The second chip includes a first circuit provided on a second substrate in a circuit region, a plurality of second pads provided on the second substrate and disposed in an edge region of the second chip that surrounds the circuit region, and a second conductive layer provided on the second substrate and electrically connected to the second pads. The first pads of the first chip and the second pads of the second chip are bonded facing each other.

Abstract: A semiconductor wafer according to the present embodiment is a semiconductor wafer having a first face. A plurality of chip structures are provided on a plurality of chip regions of the first face. A test structure is provided on dicing regions between adjacent ones of the chip regions. The chip structures each comprise first integrated circuits provided on the semiconductor wafer, and a first stacked body provided above the first integrated circuits and including a plurality of first layers and a plurality of second layers different from the first layers alternately stacked. The test structure comprises second integrated circuits provided on the semiconductor wafer, and a second stacked body provided above the second integrated circuits and including the first layers and the second layers alternately stacked.

Abstract: A semiconductor storage device includes first and second chips. The first chip includes memory cells provided on a first substrate in a memory cell region, a plurality of first pads provided on a first surface of the first substrate and disposed in an edge region of the first chip that surrounds the memory cell region, and a first conductive layer provided on the first substrate and electrically connected to the first pads. The second chip includes a first circuit provided on a second substrate in a circuit region, a plurality of second pads provided on the second substrate and disposed in an edge region of the second chip that surrounds the circuit region, and a second conductive layer provided on the second substrate and electrically connected to the second pads. The first pads of the first chip and the second pads of the second chip are bonded facing each other.

Abstract: A semiconductor device includes a semiconductor substrate, a gate insulating film formed on the substrate, a first gate electrode formed on the gate insulating film, source and drain regions formed in the substrate so as to sandwich the first gate electrode, an intergate insulating film formed on the first gate electrode and including an opening, a second gate electrode formed on the intergate insulating film and electrically connected to the first gate electrode through the opening, and a boost electrode formed on the intergate insulating film and electrically isolated from the first gate electrode and the second gate electrode.

Abstract: The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.

Abstract: A semiconductor device includes a semiconductor substrate, a gate insulating film formed on the substrate, a first gate electrode formed on the gate insulating film, source and drain regions formed in the substrate so as to sandwich the first gate electrode, an intergate insulating film formed on the first gate electrode and including an opening, a second gate electrode formed on the intergate insulating film and electrically connected to the first gate electrode through the opening, and a boost electrode formed on the intergate insulating film and electrically isolated from the first gate electrode and the second gate electrode.

Abstract: The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.

Abstract: The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.

Abstract: A clamp circuit is connected to one-side ends of first and second bit lines which are adjacent in a memory cell array and a data cache is connected to the other ends thereof. The first and second bit lines are selectively divided into plural portions by use of first and second switching elements. The data cache, clamp circuit and first and second switching elements are controlled by use of a control circuit and the bit line to which a memory cell of an address to be written is connected is precharged by use of the clamp circuit or data cache and the other bit line is shielded by the clamp circuit.

Abstract: A nonvolatile semiconductor memory device includes write/verify circuits, a switching elements which divides the bit lines into plural portions, and a control circuit. The control circuit is configured to control the write/verify circuits and switching elements. The control circuit performs a control operation to perform the write and verify operations with the switching elements set in an OFF state when a memory cell of an address to be written lies on the write/verify circuit side in the memory cell array, write and save data into a memory cell lying on the write/verify circuit side with the switching elements set in the OFF state when the memory cell lies farther apart from the write/verify circuit than the switching elements, and then turn ON the switching elements while the write/verify circuit is not being operated and write the saved data into a memory cell of an address to be written.

Abstract: A nonvolatile semiconductor memory device includes write/verify circuits, a switching elements which divides the bit lines into plural portions, and a control circuit. The control circuit is configured to control the write/verify circuits and switching elements. The control circuit performs a control operation to perform the write and verify operations with the switching elements set in an OFF state when a memory cell of an address to be written lies on the write/verify circuit side in the memory cell array, write and save data into a memory cell lying on the write/verify circuit side with the switching elements set in the OFF state when the memory cell lies farther apart from the write/verify circuit than the switching elements, and then turn ON the switching elements while the write/verify circuit is not being operated and write the saved data into a memory cell of an address to be written.

Abstract: A clamp circuit is connected to one-side ends of first and second bit lines which are adjacent in a memory cell array and a data cache is connected to the other ends thereof. The first and second bit lines are selectively divided into plural portions by use of first and second switching elements. The data cache, clamp circuit and first and second switching elements are controlled by use of a control circuit and the bit line to which a memory cell of an address to be written is connected is precharged by use of the clamp circuit or data cache and the other bit line is shielded by the clamp circuit.

Abstract: The non-volatile semiconductor memory device has a circuit which maintains and holds the potentials of bit lines, and either ones of even-bit lines or odd-bit lines are connected to the circuit. When the bit line potential holding circuit is connected to even-bit lines and a block copy is performed, data is first outputted to the even-bit lines, and after the potential of the even-bit line is determined, the bit line potential holding circuit operates. Then, biasing of the potential of the even-bit lines is carried out by the bit line potential holding circuit, the potentials of the bit lines are maintained and held. At the same time, data is outputted to the odd-bit lines and the potentials of the odd-bit lines are determined. Then, a program voltage is supplied to a selected word line, and data is simultaneously written (programmed) in the memory cells connected to the even-bit lines, and the memory cells connected to the odd-bit lines.

Abstract: A semiconductor device has an internal circuit (2), a PAD, a NMOS Tr (QN) as a protective transistor formed between a node (N) on a signal line and a first power source (Vss), and a NOR gate (G1) as a logical gate connected to a gate as a control terminal of the NMOS transistor (QN). The internal circuit (2) is connected to the PAD through the signal line. The NOR gate (G1) keeps the protective transistor (QN) an OFF state during a normal operation of the internal circuit (2). In addition, the semiconductor device further includes a test circuit (21). The output from the NOR gate (G1), whose one input is the output from the test circuit (21), is supplied to the gate of the NMOS transistor (QN). The output from the test circuit (21) is thereby output to outside through the NMOS transistor (QN) and the PAD.

Abstract: A semiconductor device has pads that are arranged in such a manner as to easily accept manual needles to carry out a test. This technique is applicable to carry out a test with use of a boundary scan test circuit in synchronization with a cycle time defined by a normal operation clock signal. The semiconductor device has a first pad connected to a first one of registers that form a serial scan chain, to supply test data to the registers, a second pad connected to a last one of the registers, and a third pad to supply a test clock signal to the registers. The registers are arranged in a central part of the semiconductor device, and the first to third pads are arranged at the periphery of the semiconductor device.

Abstract: A semiconductor device has an output buffer having transistors connected in parallel for an external driving purpose, a connection terminal connected to an external resistor, and an output impedance controller connected to the connection terminal and the output buffer, for adjusting the impedance of the output buffer in accordance with the external resistor.

Abstract: A semiconductor device is provided with at least one transistor formed on a semiconductor substrate, the transistor being provided with a conductive sidewall spacer, and at least one conductive film formed so as to face a gate of the transistor via an insulative film, the conductive film covering at least an entire region of a gate region of the transistor and acting as a capacitor electrode. The conductive sidewall spacer and the conductive film are connected together. A potential is supplied to the conductive sidewall spacer and the conductive film, the potential being different from a potential of the gate of the transistor.

Abstract: A semiconductor memory device including a plurality of cell array sections each having a plurality of memory cells disposed in a matrix form, the plurality of cell array sections being juxtaposed in a row direction. Main word lines, are each provided in common for all of the plurality of cell array sections in each row, a row select signal being applied to each main word line. Section word lines are connected to memory cells, in each cell array section at each row, for activating the memory cells. Section select lines are provided for each cell array section, a section selection signal being applied to each section select line. Logical circuits are provided for each cell array section, each logical circuit being connected to each main word line and the section select line, executing a logical operation between the row select signal and the section select signal, and activating the section select line when the logical operation result satisfies a predetermined logical condition.

Abstract: A semiconductor memory device including a plurality of cell array sections each having a plurality of memory cells disposed in a matrix form, the plurality of cell array sections being juxtaposed in a row direction. Main word lines, are each provided in common for all of the plurality of cell array sections in each row, a row select signal being applied to each main word line. Section word lines are connected to memory cells, in each cell array section at each row, for activating the memory cells. Section select lines are provided for each cell array section, a section selection signal being applied to each section select line. Logical circuits are provided for each cell array section, each logical circuit being connected to each main word line and the section select line, executing a logical operation between the row select signal and the section select signal, and activating the section select line when the logical operation result satisfies a predetermined logical condition.