Abstract: A printing machine includes two printing units, each comprising a web feed section, a web printing section connected to the web feed section and a web treating section connected to the web printing section, in which single-side surface of a continuous web is printed at each of the web printing sections, and an turn/transfer section at which two printing units are operatively connected and the continuous web printed by one of the two web printing sections is transferred to the other one thereof through turning and transferring treatment of the continuous web.

Abstract: In a process of manufacturing semiconductor chips, first, the reverse of a wafer, on the obverse of which many chips are formed, is ground so as to shape the wafer with a predetermined thickness. Then, the reverse of the wafer is polished or etched so that the broken layer which is formed during the back grinding is removed. Next, grooves are formed on the reverse of the wafer in a predetermined depth along streets formed between the chips. Finally, the wafer is cleft along the grooves so as to be divided into separate chips. By this process, the broken layer formed on the reverse of the wafer is removed after the back grinding, then the wafer is divided into separate chips by use of the cleavage; therefore, chipping is effectively reduced.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.

Abstract: A polishing stage is mounted on a body provided with a rough grinding stage and a fine grinding stage so that a wafer can be roughly ground, finely ground and polished in one planarization apparatus. The planarization apparatus also has a cleaning stage for cleaning a polishing pad of the polishing stage to thereby clean the dirty cleaning pad. The planarization apparatus is also provided with an etching unit to thereby perform a sequence of planarization from the rough grinding to the etching.

Abstract: A planarization apparatus has a stocker in which a dressing board is stored. The dressing board is picked up from the stocker and mounted on a chuck table by a transport robot. Then, dressing of a grinding wheel or a polishing pad is performed with the dressing board. Thereafter, the used dressing board is withdrawn into the stocker by the transport robot after the process through cleaning and drying.

Abstract: An ink jet printer of the type having a plurality or multiplicity of ink jet heads for printing as many characters on a continuous strip of paper or the like traveling between a pair of guide rollers or the like. In order to prevent the strip from fluttering while traveling the elongate distance between the pair of guide rollers, one or more intermediate guide rollers are provided therebetween, in positions offset from a plane tangent to both guide rollers toward one side of the plane opposite to the side where the guide rollers are located. At least two ink jet heads may be provided between every two neighboring pair of guide and intermediate guide rollers.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage, A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A round groove is formed at the center of a wafer sucking face of a wafer suction pad. A plurality of annular grooves are formed on the wafer sucking face concentrically with the round groove. Each of the grooves is connected with an air intake line. Each of the air intake lines is connected with an air sucking device via a valve. Intake of the air is controlled by opening and closing of each of the valves. When holding the wafer by suction, the air is sucked only from the groove or grooves located inside the outer diameter of the held wafer. Therefore, the entire face of each of wafers of various sizes can be appropriately held by one wafer suction pad.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.