Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

Abstract: A capacitor includes: an anode part that is drawn from an anode body of a capacitor element to an element end-face, to be formed over the element end-face; a cathode part that is drawn from a cathode body of the capacitor element to the element end-face, to be formed over the element end-face; an anode terminal member that is disposed in a sealing member; a cathode terminal member that is disposed in the sealing member; an anode current collector plate that is connected to the anode part, and is also connected to the anode terminal member; and a cathode current collector plate that is connected to the cathode part, and is also connected to the cathode terminal member.

Abstract: A capacitor includes: an anode part that is drawn from an anode body of a capacitor element to an element end-face, to be formed over the element end-face; a cathode part that is drawn from a cathode body of the capacitor element to the element end-face, to be formed over the element end-face; an anode terminal member that is disposed in a sealing member; a cathode terminal member that is disposed in the sealing member; an anode current collector plate that is connected to the anode part, and is also connected to the anode terminal member; and a cathode current collector plate that is connected to the cathode part, and is also connected to the cathode terminal member.

Abstract: A printed wiring board has a via land, a glass epoxy resin layer, a via conductor, and a block layer. The via land is formed on a core layer. The glass epoxy resin layer is formed on the core layer and the via land. The via conductor is formed on the via land. The block layer is formed on the via land, between the via conductor and the glass epoxy resin layer.

Abstract: Methods and apparatuses to perform soldering while the chip is held by a head under melted solder condition are disclosed. Solder bumps 3 are formed on the chip 1, and they are opposite to terminals 11 on a mounting board 10. Furthermore, a heating block 21 is located at the back of the chip, and it raises the temperature of the solder bumps 3 on the chip 1 to a melting point by heating the chip back by conduction. Preferably, another heating block 22 is located at the back of the mounting board 10. Soldering is performed by bringing the solder bumps 3 into contact with the terminals 11 while the solder is melted.

Abstract: An aqueous resin dispersion prepared by dispersing in an aqueous medium in the presence of ammonia or an amine a composite resin composition comprising carboxylic groups in an excessive amount and a reaction product obtained by at least partially reacting a specific acrylic resin (A), a specific aromatic epoxy resin (B) and a specific phenolic resin (C),characterized in that the acrylic resin (A) and the aromatic epoxy resin (B) are at least partially reacted with each other, and the phenolic resin (C) is pre-condensed with the acrylic resin (A) or aromatic epoxy resin (B).