Abstract: A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated terminal plate (3) that includes, at the outer surface thereof, an insertion hole (2a) to which a pair of lead wires (2) introduced from a sealing member of a capacitor body are inserted and a first concave groove (2a) for storing lead wires (2) inserted to the hole while lead wires (2) being bent in an orthogonal direction. Insulated terminal plate (3) is attached to the capacitor so as to be abutted with the above sealing member. Metal electrode (4) is buried in an inner face of first concave groove (2a) provided in insulated terminal plate (3) and the periphery thereof.

Abstract: A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated terminal plate (3) that includes, at the outer surface thereof, an insertion hole (2a) to which a pair of lead wires (2) introduced from a sealing member of a capacitor body are inserted and a first concave groove (2a) for storing lead wires (2) inserted to the hole while lead wires (2) being bent in an orthogonal direction. Insulated terminal plate (3) is attached to the capacitor so as to be abutted with the above sealing member. Metal electrode (4) is buried in an inner face of first concave groove (2a) provided in insulated terminal plate (3) and the periphery thereof.

Abstract: A method for producing aluminum electrolytic capacitors by inserting a pair of lead wires extended from an end surface of a capacitor body into through holes provided in an insulation board, by bending the pair of lead wires to fit uniformly in the grooves formed on the bottom surface of the insulation board, and by cutting projected portions of the pair of lead wires projecting from the brim face of the insulation board.