Abstract: A method for correcting displacement of a multi card with respect to a product wafer, includes displacing a predetermined wafer on a stage of a probing device and forming a contact trace of a probe needle on a surface of the wafer by bringing the probe needle into contact with the wafer disposed on the stage; localizing, based on the contact trace, a displaced area from the surface of the wafer, the area being displaced with respect to the multi card, and determining a displacement amount of the displaced area; and setting a parameter based on the displacement amount, the parameter to be referred in the case of positioning of the multi card to the displaced area. The displacement of the multi card is corrected in a case of testing electric characteristics of a plurality of circuit elements formed on the product wafer with the use of the multi card capable of bringing the probe needles into contact with the plurality of circuit elements all at once.

Abstract: A method for correcting displacement of a multi card with respect to a product wafer, includes displacing a predetermined wafer on a stage of a probing device and forming a contact trace of a probe needle on a surface of the wafer by bringing the probe needle into contact with the wafer disposed on the stage; localizing, based on the contact trace, a displaced area from the surface of the wafer, the area being displaced with respect to the multi card, and determining a displacement amount of the displaced area; and setting a parameter based on the displacement amount, the parameter to be referred in the case of positioning of the multi card to the displaced area. The displacement of the multi card is corrected in a case of testing electric characteristics of a plurality of circuit elements formed on the product wafer with the use of the multi card capable of bringing the probe needles into contact with the plurality of circuit elements all at once.