Patents by Inventor Yasushi Oyama
Yasushi Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240116429Abstract: To improve pedestrian visibility. Provided is a headlight controller connectable to a first headlight and a second headlight spaced apart in a vehicle width direction at the front of the vehicle, the headlight controller including: a rainfall amount detection means installed in the vehicle; and a controller installed in the vehicle, where the controller is connected to the rainfall amount detection means, and the controller carries out control such that when rainfall amount detected by the rainfall amount detection means is equal to or more than a predetermined value, irradiation light from the first headlight becomes relatively darker than irradiation light from the second headlight.Type: ApplicationFiled: December 13, 2021Publication date: April 11, 2024Applicant: Stanley Electric Co., Ltd.Inventors: Wataru NAKASHIMA, Yasushi KITA, Takako KIMURA, Shuto OYAMA, Kouki KUDO, Akihisa KUMAKURA
-
Publication number: 20220255180Abstract: An electronic device includes a flexible substrate, a circuit substrate, and a battery pack including a conductor portion. The battery pack includes a battery that supplies power to the circuit substrate and includes a main surface and a side surface. The flexible substrate includes a radiating conductor. The flexible substrate includes bent portions at a central portion in the direction in which a transmission line extends so that the flexible substrate faces the side surface. The radiating conductor overlaps the conductor portion of the main surface of the battery pack in plan view.Type: ApplicationFiled: April 27, 2022Publication date: August 11, 2022Inventors: Nobuyuki TENNO, Yasushi OYAMA, Daisuke SAKAI, Byung No BAE
-
Patent number: 10483928Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.Type: GrantFiled: March 20, 2018Date of Patent: November 19, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasushi Oyama, Takayuki Tsutsui, Kazuhito Nakai
-
Publication number: 20180212578Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.Type: ApplicationFiled: March 20, 2018Publication date: July 26, 2018Inventors: Yasushi OYAMA, Takayuki TSUTSUI, Kazuhito NAKAI
-
Patent number: 9954504Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.Type: GrantFiled: November 30, 2016Date of Patent: April 24, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yasushi Oyama, Takayuki Tsutsui, Kazuhito Nakai
-
Publication number: 20170163229Abstract: A power amplification module includes a first input terminal that receives a first transmit signal in a first frequency band, a second input terminal that receives a second transmit signal in a second frequency band having a narrower transmit/receive frequency interval than the first frequency band, a first amplification circuit that receives and amplifies the first transmit signal to produce a first amplified signal and outputs the first amplified signal, a second amplification circuit that receives and amplifies the second transmit signal to produce a second amplified signal and outputs the second amplified signal, a third amplification circuit that receives and amplifies the first or second amplified signal to produce an output signal and outputs the output signal, and an attenuation circuit located between the second input terminal and the second amplification circuit and configured to attenuate a receive frequency band component of the second frequency band.Type: ApplicationFiled: November 30, 2016Publication date: June 8, 2017Inventors: Yasushi OYAMA, Takayuki TSUTSUI, Kazuhito NAKAI
-
Patent number: 4804560Abstract: A method of selectively depositing tungsten upon a silicon semiconductor substrate. A silicon substrate is coated with a masking film of PSG or SiO.sub.2 that is patterned to provide an opening for forming an electrode or wiring. On a portion of the substrate in the opening, a layer of tungsten having a thickness of approximately 2000 .ANG. is deposited by a CVD method from an atomosphere containing a gaseous mixture of WF.sub.6 and H.sub.2 . During this processing, tungsten nucleuses deposit on the surface of the masking film as well. Before such nucleuses form a film, the deposition processing is discontinued and H.sub.2 gas is fed into the CVD apparatus to produce HF, which etches the surface of the masking film, and thus tungsten nucleuses are removed. The deposition and removal steps are repeated several times until the height of the deposited tungsten and the thickness of the masking film are essentially equal to present a flat surface.Type: GrantFiled: March 17, 1987Date of Patent: February 14, 1989Assignee: Fujitsu LimitedInventors: Yoshimi Shioya, Yasushi Oyama, Norihisa Tsuzuki, Mamoru Maeda, Masaaki Ichikawa, Fumitake Mieno, Shin-ichi Inoue, Yasuo Uo-ochi, Akira Tabuchi, Atsuhiro Tsukune, Takuya Watanabe, Takayuki Ohba