Abstract: Provided is a test apparatus including a test head main body 130 that communicates a signal with the device under test 200, a prober 110 on which the device under test 200 is mounted, and a probe card 300 positioned between the test head main body 130 and the prober 110, where the probe card 300 includes: a plurality of probe pins 320 provided on a surface thereof facing the prober 110 and electrically connected to a terminal of the device under test 200; a plurality of test head pads 330 provided on a surface thereof facing the test head main body 130 and electrically connected to spring pins 129 on the test head main body 130 and to the probe pins 320; and prober pads 340 provided on a surface thereof facing the prober 110 and electrically connected to the plurality of probe pins 320.

Abstract: Provided is a test apparatus including a test head main body 130 that communicates a signal with the device under test 200, a prober 110 on which the device under test 200 is mounted, and a probe card 300 positioned between the test head main body 130 and the prober 110, where the probe card 300 includes: a plurality of probe pins 320 provided on a surface thereof facing the prober 110 and electrically connected to a terminal of the device under test 200; a plurality of test head pads 330 provided on a surface thereof facing the test head main body 130 and electrically connected to spring pins 129 on the test head main body 130 and to the probe pins 320; and prober pads 340 provided on a surface thereof facing the prober 110 and electrically connected to the plurality of probe pins 320.

Abstract: A semiconductor device of a film carrier package type in which wiring patterns formed on a flexible film are connected to electrodes that are used to make contacts with an external circuit and are formed on a semiconductor element or semiconductor elements mounted on the semiconductor device. The flexible film is designed so that the product of Young's modulus and the cube of film thickness of a material of the flexible film is smaller than 4.03×10?4 (Pa·m3), and that the inverse of the product of Young's modulus and thickness of the flexible film material is smaller than 4.42×10?6 (Pa?1·m?1). As a result, a semiconductor device and a display module using it are provided in which a substrate formed of a base film can be suitably bent, and in which sprocket holes of the base film will not be broken during transport.