Patents by Inventor Yasushi Takaki
Yasushi Takaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935919Abstract: A method for manufacturing a semiconductor device includes forming, on first and second impurity layers on a termination region side, an insulating layer, forming a first metal film and a second metal film in this order on the insulating layer and a drift layer, performing dry etching on the first and second metal films all together so that a position of a first end of a metallized layer, which is a remaining part of the first metal film, in the interface region on the termination region side and a position of a second end of an electrode, which is a remaining part of the second metal film, in the interface region on the terminal region side are the same in plan view. The first and second ends are closer to the active region than an end of the second impurity layer on the termination region side in plan view.Type: GrantFiled: August 1, 2022Date of Patent: March 19, 2024Assignee: Mitsubishi Electric CorporationInventors: Yoshinori Matsuno, Yasushi Takaki, Kensuke Taguchi, Kosuke Miyazaki
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Patent number: 11804555Abstract: The present invention relates to a semiconductor device, wherein the semiconductor substrate includes: a semiconductor layer; and a well region, the semiconductor device includes: a surface electrode provided on a second main surface on a side opposite to a first main surface; a back surface electrode provided on the first main surface; and an upper surface film covering an end edge portion of the surface electrode and at least part of an outer side region outside an end surface of the surface electrode of the semiconductor substrate, the well region includes a portion extending to the outer side region and a portion extending to an inner side region inside the end surface of the surface electrode, and the upper surface film includes at least one outer peripheral opening part provided along an outer periphery of the surface electrode away from the surface electrode of the outer side region.Type: GrantFiled: January 29, 2019Date of Patent: October 31, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kohei Ebihara, Shiro Hino, Kosuke Miyazaki, Yasushi Takaki
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Publication number: 20230197476Abstract: According to the present disclosure, a semiconductor manufacturing apparatus comprises a pickup stage having a mechanism for lifting and lowering a semiconductor chip having a square shape. The pickup stage comprises first pushing-up blocks at four corners. Each of the first pushing-up blocks comprises a first side parallel to one side of the semiconductor chip, a second side parallel to another side of the semiconductor chip, and an offset portion formed between the first side and the second side to be offset to an inward side of an intersection point of respective extension lines of the first side and the second side.Type: ApplicationFiled: July 22, 2022Publication date: June 22, 2023Applicant: Mitsubishi Electric CorporationInventors: Masaki UENO, Kinya YAMASHITA, Yasushi TAKAKI
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Patent number: 11624767Abstract: A semiconductor test apparatus according to the present disclosure includes: a stage on which a wafer is to be mounted; a pressurizing wall disposed on a surface of a probe card opposing the stage, extending toward the stage, and having an opening; a mark disposed on a lower surface of the pressurizing wall opposing the stage; a probe disposed in the opening; an air tube to force air into the opening; a detector to detect first spacing between a tip of the probe and the mark; and a controller to control second spacing between the wafer and the lower surface of the pressurizing wall based on the first spacing, wherein, when an electrical property of each of chips of the wafer is measured, the second spacing is controlled to be predetermined spacing by the controller, and the air is forced into the opening through the air tube.Type: GrantFiled: July 27, 2021Date of Patent: April 11, 2023Assignee: Mitsubishi Electric CorporationInventors: Yasushi Takaki, Kinya Yamashita, Masaki Ueno
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Publication number: 20220367613Abstract: A method for manufacturing a semiconductor device includes forming, on first and second impurity layers on a termination region side, an insulating layer, forming a first metal film and a second metal film in this order on the insulating layer and a drift layer, performing dry etching on the first and second metal films all together so that a position of a first end of a metallized layer, which is a remaining part of the first metal film, in the interface region on the termination region side and a position of a second end of an electrode, which is a remaining part of the second metal film, in the interface region on the terminal region side are the same in plan view. The first and second ends are closer to the active region than an end of the second impurity layer on the termination region side in plan view.Type: ApplicationFiled: August 1, 2022Publication date: November 17, 2022Applicant: Mitsubishi Electric CorporationInventors: Yoshinori MATSUNO, Yasushi TAKAKI, Kensuke TAGUCHI, Kosuke MIYAZAKI
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Patent number: 11437465Abstract: A semiconductor device includes an insulating layer provided on a first impurity layer and a second impurity layer on a termination region side, a metallized layer provided on the first impurity layer and the second impurity layer exposed from the insulating layer and on the insulating layer, and an electrode provided on the metallized layer. A position of a first end of the metallized layer on the termination region side and a position of a second end of the electrode on the termination region side are the same in plan view.Type: GrantFiled: April 10, 2020Date of Patent: September 6, 2022Assignee: Mitsubishi Electric CorporationInventors: Yoshinori Matsuno, Yasushi Takaki, Kensuke Taguchi, Kosuke Miyazaki
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Publication number: 20220128616Abstract: A semiconductor test apparatus according to the present disclosure includes: a stage on which a wafer is to be mounted; a pressurizing wall disposed on a surface of a probe card opposing the stage, extending toward the stage, and having an opening; a mark disposed on a lower surface of the pressurizing wall opposing the stage; a probe disposed in the opening; an air tube to force air into the opening; a detector to detect first spacing between a tip of the probe and the mark; and a controller to control second spacing between the wafer and the lower surface of the pressurizing wall based on the first spacing, wherein, when an electrical property of each of chips of the wafer is measured, the second spacing is controlled to be predetermined spacing by the controller, and the air is forced into the opening through the air tube.Type: ApplicationFiled: July 27, 2021Publication date: April 28, 2022Applicant: Mitsubishi Electric CorporationInventors: Yasushi TAKAKI, Kinya YAMASHITA, Masaki UENO
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Patent number: 11295954Abstract: Polysilicon films (P1,P2) are simultaneously formed on a wafer (W1) and a monitor wafer (W2) under the same growth condition in a wafer process. At least one of a film thickness and phosphorus concentration of the polysilicon film (P2) formed on the monitor wafer (W2) is measured to obtain a measured value. One of a plurality of mask patterns (A,B,C) is selected based on the measured value. The polysilicon film (P1) formed on the wafer (W1) is etched using the selected mask pattern to form the polysilicon resistor (5).Type: GrantFiled: July 4, 2016Date of Patent: April 5, 2022Assignee: Mitsubishi Electric CorporationInventors: Yasushi Takaki, Eisuke Suekawa, Chihiro Tadokoro
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Publication number: 20210399144Abstract: The present invention relates to a semiconductor device, wherein the semiconductor substrate includes: a semiconductor layer; and a well region, the semiconductor device includes: a surface electrode provided on a second main surface on a side opposite to a first main surface; a back surface electrode provided on the first main surface; and an upper surface film covering an end edge portion of the surface electrode and at least part of an outer side region outside an end surface of the surface electrode of the semiconductor substrate, the well region includes a portion extending to the outer side region and a portion extending to an inner side region inside the end surface of the surface electrode, and the upper surface film includes at least one outer peripheral opening part provided along an outer periphery of the surface electrode away from the surface electrode of the outer side region.Type: ApplicationFiled: January 29, 2019Publication date: December 23, 2021Applicant: Mitsubishi Electric CorporationInventors: Kohei EBIHARA, Shiro HINO, Kosuke MIYAZAKI, Yasushi TAKAKI
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Publication number: 20200395439Abstract: A semiconductor device includes an insulating layer provided on a first impurity layer and a second impurity layer on a termination region side, a metallized layer provided on the first impurity layer and the second impurity layer exposed from the insulating layer and on the insulating layer, and an electrode provided on the metallized layer. A position of a first end of the metallized layer on the termination region side and a position of a second end of the electrode on the termination region side are the same in plan view.Type: ApplicationFiled: April 10, 2020Publication date: December 17, 2020Applicant: Mitsubishi Electric CorporationInventors: Yoshinori MATSUNO, Yasushi TAKAKI, Kensuke TAGUCHI, Kosuke MIYAZAKI
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Patent number: 10665713Abstract: A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate having an n-type drift layer, and a p-type well region formed in a surface portion of a part of the drift layer, an insulating film provided on the well region, a gate built-in resistor formed of polysilicon in contact with a surface of the insulating film, an interlayer insulating film formed on the gate built-in resistor, a gate contact wire that is connected to a gate pad and formed on the interlayer insulating film, a gate wire provided on the interlayer insulating layer so as to be apart from the gate contact wire, a first gate contact for electrically connecting the gate contact wire and the gate built-in resistor, and a second gate contact for electrically connecting the gate wire and the gate built-in resistor.Type: GrantFiled: July 23, 2018Date of Patent: May 26, 2020Assignee: Mitsubishi Electric CorporationInventors: Takaaki Tominaga, Yasushi Takaki, Yoichiro Tarui, Shiro Hino
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Publication number: 20190115217Abstract: Polysilicon films (P1,P2) are simultaneously formed on a wafer (W1) and a monitor wafer (W2) under the same growth condition in a wafer process. At least one of a film thickness and phosphorus concentration of the polysilicon film (P2) formed on the monitor wafer (W2) is measured to obtain a measured value. One of a plurality of mask patterns (A,B,C) is selected based on the measured value. The polysilicon film (P1) formed on the wafer (W1) is etched using the selected mask pattern to form the polysilicon resistor (5).Type: ApplicationFiled: July 4, 2016Publication date: April 18, 2019Applicant: Mitsubishi Electric CorporationInventors: Yasushi TAKAKI, Eisuke SUEKAWA, Chihiro TADOKORO
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Publication number: 20190097043Abstract: A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate having an n-type drift layer, and a p-type well region formed in a surface portion of a part of the drift layer, an insulating film provided on the well region, a gate built-in resistor formed of polysilicon in contact with a surface of the insulating film, an interlayer insulating film formed on the gate built-in resistor, a gate contact wire that is connected to a gate pad and formed on the interlayer insulating film, a gate wire provided on the interlayer insulating layer so as to be apart from the gate contact wire, a first gate contact for electrically connecting the gate contact wire and the gate built-in resistor, and a second gate contact for electrically connecting the gate wire and the gate built-in resistor.Type: ApplicationFiled: July 23, 2018Publication date: March 28, 2019Applicant: Mitsubishi Electric CorporationInventors: Takaaki TOMINAGA, Yasushi TAKAKI, Yoichiro TARUI, Shiro HINO
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Patent number: 9985124Abstract: The present invention can reduce an on-resistance while suppressing reduction in a short circuit capacity. The present invention includes a SiC epitaxial layer, a well region, a source region, a channel resistance adjusting region, a gate electrode, an interlayer insulating film, a source electrode, and a drain electrode. The channel resistance adjusting region is sandwiched between the source region and the SiC epitaxial layer in a surface layer of the well region. The channel resistance adjusting region is a region in which a first impurity region is intermittently formed in a direction intersecting a direction in which the source region and the SiC epitaxial layer sandwich the channel resistance adjusting region.Type: GrantFiled: June 27, 2014Date of Patent: May 29, 2018Assignee: Mitsubishi Electric CorporationInventors: Yasushi Takaki, Yoichiro Tarui
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Publication number: 20170054017Abstract: The present invention can reduce an on-resistance while suppressing reduction in a short circuit capacity. The present invention includes a SiC epitaxial layer, a well region, a source region, a channel resistance adjusting region, a gate electrode, an interlayer insulating film, a source electrode, and a drain electrode. The channel resistance adjusting region is sandwiched between the source region and the SiC epitaxial layer in a surface layer of the well region. The channel resistance adjusting region is a region in which a first impurity region is intermittently formed in a direction intersecting a direction in which the source region and the SiC epitaxial layer sandwich the channel resistance adjusting region.Type: ApplicationFiled: June 27, 2014Publication date: February 23, 2017Applicant: Mitsubishi Electric CorporationInventors: Yasushi TAKAKI, Yoichiro TARUI
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Patent number: 5841792Abstract: In a processing system having a testing mechanism for implementing a test on a high density packaging printed circuit board, a data storing unit has an object chip component set unit in which information as to at least one object chip component is set in order to designate the object chip component, a data storage for object chip component for holding therein data that should be written into a register of the object chip component, and a data control unit for writing data held in the data storage for object chip component into the register of the object chip component set in the object chip component set unit in a shifting operation, whereby predetermined data may be written in a register in the testing mechanism without causing an increase of the number of registers for setting data or a storage region used to set data therein so as to simplify a system structure or improve an efficiency of a data setting process.Type: GrantFiled: September 24, 1996Date of Patent: November 24, 1998Assignee: Fujitsu LimitedInventors: Kayoko Kawano, Yasushi Takaki
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Patent number: 5781560Abstract: A method and system testing device for testing a printed circuit board includes a JTAG circuit provided with a JTAG instruction storage unit for storing a command to control a system logic circuit; and a JTAG data storage unit for storing data used to control the system logic circuit. The system testing device tests the system logic circuit in an LSI by selectively inputting/outputting data to a boundary scan register, a bypass register, the JTAG instruction storage unit, and the JTAG data storage unit.Type: GrantFiled: July 30, 1997Date of Patent: July 14, 1998Assignee: Fujitsu LimitedInventors: Kayoko Kawano, Yasushi Takaki, Shinichi Sutou, Kazuhiro Hara
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Patent number: 5721821Abstract: An information processing system has a plurality of information processing units. Each information processing unit has a system console interface control unit (SCI) connected to an information processing unit body (COM) and a service processor (SVP). The plurality of system console interface control units (SCI) are connected each other in a ring fashion. Each system console interface control unit (SCI) has a processing devcice for processing an interface between the self-service processor (SVP0) and the other-information processing unit body (COM1).Type: GrantFiled: May 28, 1996Date of Patent: February 24, 1998Assignee: Fujitsu LimitedInventors: Kayoko Kawano, Satoshi Sugiura, Yasushi Takaki