Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.

Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.

Abstract: A multiprocessor system, in which a memory card can be easily accessed from a data processor other than a data processor to which the memory card is connected without impeding processing, has been disclosed. The multiprocessor system comprises data processors wherein a first data processor comprises a memory card interface, a first communication interface, and a first buffer, and another data processor comprises a second communication interface, and when the other data processor reads data from the memory card, the first data processor transmits data after reading the data of the memory card in accordance with the condition of processing and storing the data temporarily in the first buffer and, when the other data processor writes data to the memory card, the first data processor stores the data from the other data processor in the first buffer irrespective of the condition of processing of the first data processor and writes the data to the memory card in accordance with the condition of processing.

Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.

Abstract: The photocationic-curable resin composition of the invention comprises (A) a cationic-polymerizable compound, (B) a photocationic initiator and (C) an aromatic ether compound or an aliphatic thioether compound. The photocationic-curable resin composition has excellent conversion (curability) at low temperatures, and its cured product exhibits excellent adhesive strength and moisture permeation resistance. According to the sealing material comprising the composition, a liquid crystal display or an electroluminescent display having excellent adhesive strength and moisture permeation resistance can be provided with high productivity.

Abstract: An ink composition is provided which can realize an image having excellent rubbing/scratch resistance and waterfastness, is free from a clogged nozzle problem, and enables stable printing. The ink composition comprises a colorant, a fine particle of a polymer, a water-soluble organic solvent, and water, the fine particle of the polymer having a film-forming property, a carboxyl group on its surface, and a reactivity with a divalent metal salt such that, when three volumes of an aqueous emulsion, of the fine particle of the polymer, having a fine particle concentration of 0.1% by weight is brought into contact with one volume of an aqueous divalent metal salt solution having a concentration of 1 mol/liter, the time for the transmission of light at a wavelength of 700 nm to be decreased to 50% of the initial transmission is not more than 1×104 sec.