Abstract: Disclosed herein is a semiconductor laser device that has a higher heat dissipation property, comprising: a base; a block protruding from a first surface of the base; a laser chip being joined onto a side face rising upward from the first surface, and allowing heat generated to be transferred to the block; a cap covering the block and be fixed on the first surface; a window provided in the cap and allowing the light emitted from the laser chip to pass through; at least one lead pin penetrating the base, one end of the lead pin protruding inside the cap, and any of the lead pin being positioned at an opposite side of the block with respect to the laser chip; and a pinless region extending in a range of the base corresponding to a rear side of the block and provided with none of pins including the lead pin.

Abstract: Disclosed herein is a semiconductor laser device that has a higher heat dissipation property, comprising: a base; a block protruding from a first surface of the base; a laser chip being joined onto a side face rising upward from the first surface, and allowing heat generated to be transferred to the block; a cap covering the block and be fixed on the first surface; a window provided in the cap and allowing the light emitted from the laser chip to pass through; at least one lead pin penetrating the base, one end of the lead pin protruding inside the cap, and any of the lead pin being positioned at an opposite side of the block with respect to the laser chip; and a pinless region extending in a range of the base corresponding to a rear side of the block and provided with none of pins including the lead pin.

Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.

Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.

Abstract: A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.

Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.

Abstract: An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement gold plating solution contains a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting an even plated appearance and also having a thick gold coating film.

Abstract: An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The present invention provides an electroless displacement gold plating solution containing a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting a even plated appearance and also having a thick gold coating film.

Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Abstract: Electroless gold plating baths and plating methods using these baths are provided. The electroless gold plating bath includes i) water-soluble gold compound, ii) complexing agent that stabilizes gold ions in the plating bath, but does not cause substantial dissolution of nickel, cobalt or palladium in the plating bath, and iii) a polyethyleneimine compound. When a material to be plated is subjected to such a gold plating bath, corrosion of the base metal under the surface of the material to be plated is reduced by controlling the substitution reaction rate immediately after initiation of the reaction, and adhesion between the base metal and deposited gold coating is increased.

Abstract: Electrolyte compositions useful for forming gold coatings on nickel containing substrates are disclosed. Also disclosed are methods of plating gold layers on nickel containing substrates.

Abstract: The present invention provides an excellent non-electrolytic gold plating liquid which produces a gold plating layer firmly adhered to a surface selected from the group consisting of nickel, cobalt, palladium or a metal alloy containing nickel, cobalt or palladium, as well as a method for performing a non-electrolytic gold plating method using the non-electrolytic gold plating liquid. The non-electrolytic gold plating liquid comprises: (1) a water-soluble gold compound; (2) a complexation agent which stabilizes a gold ion in the plating liquid, but does not substantially dissolve nickel, cobalt or palladium; and (3) an anti-gold deposit agent which inhibits excess local etching or corrosion by substitution reaction between the metal surface and gold during the gold plating.

Abstract: According to the present invention there is provided a cleaning agent composition capable of removing the foulants deposited in gas turbine air compressors even during their operation and thereby cleaning the compressors.That is, there is provided a cleaning agent composition comprising(A) a solvent component consisting of a combination of a particular monovalent aliphatic alcohol-ethylene glycol adduct and a particular phenol-ethylene glycol adduct, and(B) a surfactant component consisting of a combination of a particular polyethylene glycol mono(alkylphenol) ether and an ammonium or amine salt of a particular fatty acid. Said composition is diluted with purified water and used for cleaning of gas turbine air compressors, particular their turbine blades.

Abstract: An optoelectronics device wherein a light-receiving element which defines a monitor light receiver and a semiconductor laser which generates a laser beam are hermetically sealed in the same package, and wherein the light-receiving surface of the element for measuring the output power of the beam of light emitted from the semiconductor laser is disposed so as to be inclined with respect to the light-emitting surface of the semiconductor laser. The wire bonding surface of the light-receiving element pellet-bonded to a stem and the wire bonding surface of the lead electrically connected to the light-receiving element through a wire are arranged so as to be parallel with each other. Thus, it is possible to support both the bonding surfaces horizontally at the same time. As a result, a bonding tool can be brought into perpendicular contact with each of the bonding surfaces, and this enables appropriate wire bonding to be effected.