Abstract: A headrest with a lock urging member in which unintentional change in an urging direction will hardly occur is provided. The headrest includes a first member, a second member, a backward urging member, a lock plate, a lock urging member, a lock switching member, and a resistance member. The lock switching member is provided with a switching pin abutment portion A, a switching pin abutment portion B, and a switching cam abutment portion. The lock plate includes a switching cam abutted portion. In a lock adjustment range, the lock switching member is moved together with the second member by the resistance member configured to apply resistance to movement of the lock switching member with respect to the second member. In addition, in rotation further forward beyond a forward adjustment limit position, the switching abutment portion B abuts against the switching pin fixed to the first member, so that the lock switching member does not follow the second member, whereby the headrest is unlocked.

Abstract: The present invention addresses the problem of providing a novel silicon substrate having a textured surface by dry-etching the surface of a silicon substrate having (111) orientation and thereby forming a texture thereon. The present invention provides a silicon substrate having (111) orientation, said silicon substrate having a textured surface that includes multiple protrusions which each comprise three slant faces and have heights of 100 to 8000 nm. This process for producing a silicon substrate includes: a step of preparing a silicon substrate having (111) orientation; and a step of blowing an etching gas onto the surface of the silicon substrate, said etching gas containing one or more gases selected from the group consisting of ClF3, XeF2, BrF3, BrF5 and NF3.

Abstract: An armrest comprises an arm body in which a through hole is formed, an arm connected to the arm body, a drum that includes a cylinder inserted in the through hole, a bottom, and planar walls extending outside from a part of an end of the cylinder, is arranged rearward the arm body, and pivots the arm body about the cylinder; and mounting metal fittings that are integrally connected to the drum while locking the bottom and can be mounted on the seat frame. The armrest can adjust a position of the arm at a storage state and at a use state. The planar walls are arranged in such a manner as to position in a front-and-rear direction of the arm body in the use state, and the arm body is sandwiched between the planar walls and the mounting metal fittings in an axial direction of the cylinder.

Abstract: In an electrolyte membrane for a fuel cell, having nanofiber unwoven cloth buried in an electrolyte resin, the nanofiber unwoven cloth is disposed being exposed only from one face of the electrolyte membrane. The fuel cell includes a MEA having an anode electrode disposed on one face of the electrolyte membrane and having a cathode electrode disposed on the other face thereof, and a pair of separators holding the MEA by sandwiching the MEA therebetween. Thereby, the electrolyte membrane for a fuel cell, the manufacturing method of the electrolyte membrane, and the fuel cell are provided with which the electric power generation property and productivity are improved.

Abstract: The present invention provides a thermoelectric conversion element, a thermoelectric conversion element module, and a method of manufacturing the same that can easily realize high-density arrangement of thermoelectric conversion elements and securement of connection reliability. The thermoelectric conversion element has, for example, rod-shaped thermoelectric conversion material, tube that has an insulation property and an adiabatic property and houses thermoelectric conversion material, and electrodes that are in close adhesion to the end surfaces of thermoelectric conversion material and tube. A surface roughness Ra of the end surfaces is larger than 0.8 micrometers. In the present invention, the thermoelectric conversion elements can be arranged at a high density such that tubes are in close adhesion to each other. Also, since the close adhesion surface of electrodes on the end surfaces is large, the connection reliability of electrodes is further improved.

Abstract: The rotary damper includes a brake drum (10) whose either end is integrally connected to the first member (100); a cylindrical case (20) covering the brake drum (10) in a state that the cylindrical case relatively rotates with respect to the brake drum, and being connected to the second member (200) in a state that the cylindrical case rotates in conjugation with the second member; a brake spring (30) being externally fitted to the brake drum (10) with the coil spring tightened, and being configured by a coil spring whose one end is fixed to one end of the cylindrical case (20) and other end is fixed to other end of the cylindrical case. The brake drum (10) is provided with a releasing concave portion (10c) on an outer periphery thereof and fixing portions for winding the brake spring rotating independently from the brake drum.

Abstract: The rotary damper includes a brake drum (10) whose either end is integrally connected to the first member (100); a cylindrical case (20) covering the brake drum (10) in a state that the cylindrical case relatively rotates with respect to the brake drum, and being connected to the second member (200) in a state that the cylindrical case rotates in conjugation with the second member; a brake spring (30) being externally fitted to the brake drum (10) with the coil spring tightened, and being configured by a coil spring whose one end is fixed to one end of the cylindrical case (20) and other end is fixed to other end of the cylindrical case. The brake drum (10) is provided with a releasing concave portion (10c) on an outer periphery thereof and fixing portions for winding the brake spring rotating independently from the brake drum.

Abstract: An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

Abstract: A non-plasma dry etching apparatus forms textures by processing plural substrates at the same time, and all substrates and textures in respective substrate planes are formed to be uniform at the time of processing and all substrates and values of the reflectance in respective substrate planes are formed to be uniform as well as size reduction of equipment. The substrates are placed in plural stages so as to be parallel to the flow of a process gas in a reaction chamber. The uniform etching is realized by installing turbulent flow generation blades in the upstream side of the flow.

Abstract: The present invention addresses the problem of providing a novel silicon substrate having a textured surface by dry-etching the surface of a silicon substrate having (111) orientation and thereby forming a texture thereon. The present invention provides a silicon substrate having (111) orientation, said silicon substrate having a textured surface that includes multiple protrusions which each comprise three slant faces and have heights of 100 to 8000 nm. This process for producing a silicon substrate includes: a step of preparing a silicon substrate having (111) orientation; and a step of blowing an etching gas onto the surface of the silicon substrate, said etching gas containing one or more gases selected from the group consisting of ClF3, XeF2, BrF3, BrF5 and NF3.

Abstract: The present invention provides a thermoelectric conversion element, a thermoelectric conversion element module, and a method of manufacturing the same that can easily realize high-density arrangement of thermoelectric conversion elements and securement of connection reliability. The thermoelectric conversion element has, for example, rod-shaped thermoelectric conversion material, tube that has an insulation property and an adiabatic property and houses thermoelectric conversion material, and electrodes that are in close adhesion to the end surfaces of thermoelectric conversion material and tube. A surface roughness Ra of the end surfaces is larger than 0.8 micrometers. In the present invention, the thermoelectric conversion elements can be arranged at a high density such that tubes are in close adhesion to each other. Also, since the close adhesion surface of electrodes on the end surfaces is large, the connection reliability of electrodes is further improved.

Abstract: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: A method for manufacturing a sub-harness comprises the steps of: holding a first connector housing in a guiding device for terminal insertion; holding a second connector housing in a continuity check tool; bringing a terminal at a first end of an electric wire with terminals at the both ends thereof into contact with a touch contact to make a specified light emitter of light emitters in the guiding device emit, said touch contact being connected to the guiding device via a main control device, said touch contact having a curved contact surface; inserting the terminal at the first end into a specified terminal-receiving chamber of terminal-receiving chambers in the first connector housing to bring the terminal at the first end into contact with a specified terminal contact of terminal contacts in the guiding device, said specified chamber being illuminated by said light emitter; and checking continuity between terminals at the first end and at a second end of the electric wire with a continuity check contro

Abstract: A method for manufacturing a sub-harness comprises the steps of: holding a first connector housing in a guiding device for terminal insertion; holding a second connector housing in a continuity check tool; bringing a terminal at a first end of an electric wire with terminals at the both ends thereof into contact with a touch contact to make a specified light emitter of light emitters in the guiding device emit, said touch contact being connected to the guiding device via a main control device, said touch contact having a curved contact surface; inserting the terminal at the first end into a specified terminal-receiving chamber of terminal-receiving chambers in the first connector housing to bring the terminal at the first end into contact with a specified terminal contact of terminal contacts in the guiding device, said specified chamber being illuminated by said light emitter; and checking continuity between terminals at the first end and at a second end of the electric wire with a continuity check control d

Abstract: An apparatus that can perform checking terminal lock in a connector housing securely are provided. The apparatus for checking terminal lock (1) includes a main body (8), a housing set portion (19) so as to be disposed in the main body (8) to move freely in a direction of inserting and extracting a terminal, and push means (6) for pushing the housing set portion (19) in the direction of inserting the terminal. On condition that a connector housing (2) is secured in the housing set portion (19) pushed by push means (6) and the terminal connected with a wire is inserted into the connector housing (2), terminal lock is checked by pulling the wire in a direction of extracting the terminal.