Patents by Inventor Yasushi Toyoda

Yasushi Toyoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11940347
    Abstract: A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 26, 2024
    Assignees: DENSO CORPORATION, NAGANO KEIKI CO., LTD.
    Inventors: Hiroshi Kodama, Naoki Yoshida, Kaori Miyashita, Eiji Takeda, Nobuaki Yamada, Yoshihiro Tomomatsu, Yasushi Yanagisawa, Yusuke Midorikawa, Shirou Kamanaru, Kenichi Yokoyama, Inao Toyoda, Hisayuki Takeuchi, Naohisa Niimi, Masao Takahashi, Yasutake Ura, Kouji Asano, Yukihiro Kamada
  • Patent number: 7481901
    Abstract: A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process S2, two sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process S3, the protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.
    Type: Grant
    Filed: December 1, 2005
    Date of Patent: January 27, 2009
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Yasushi Toyoda, Nobuyuki Tanaka
  • Publication number: 20060118228
    Abstract: A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process S2 and a peeling process S3. In the taping process S2, two sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process S3, the protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.
    Type: Application
    Filed: December 1, 2005
    Publication date: June 8, 2006
    Inventors: Yasushi Toyoda, Nobuyuki Tanaka
  • Patent number: 5284908
    Abstract: A copolymer latex which is useful in an adhesive composition, a paper coating composition, an adhesive composition for carpet lining and an adhesive composition for a rock fiber substrate is prepared by emulsion copolymerizing an aliphatic conjugated diene monomer and at least one other monomer copolymerizable therewith in the presence of a chain transfer agent and at least one compound having no copolymerizing reactivity selected from the group consisting of hydrocarbons having 5 to 12 carbon atoms, halogenated aromatic hydrocarbons, five or six membered ring heterocyclic compounds, aliphatic ethers and aliphatic esters in an amount of 1 to 100 parts by weight per 100 parts by weight of a total amounts of the aliphatic conjugated diene monomer and the other monomer.
    Type: Grant
    Filed: January 29, 1991
    Date of Patent: February 8, 1994
    Assignee: Sumitomo Dow Limited
    Inventors: Wataru Fujiwara, Junko Hyoda, Yasushi Toyoda, Saburo Mishiba
  • Patent number: 4963613
    Abstract: An adhesive composition comprising:a polymer latex containing a copolymer which comprises(a) 40 to 80% by weight of a conjugated diene monomer and(b) 0.5 to 30% by weight of a cyanated vinyl monomer,(c) 5 to 35% by weight of vinylpyridine and(d) not more than 53% by weight of an aromatic vinyl monomer; anda resorcin-formalin resin, which composition can adhere various fibers to rubbers.
    Type: Grant
    Filed: July 7, 1989
    Date of Patent: October 16, 1990
    Assignee: Sumitomo Naugatuck Co., Ltd.
    Inventors: Yasushi Toyoda, Saburo Mishiba
  • Patent number: 4861820
    Abstract: An adhesive composition comprising(A) 100 parts by weight of a copolymer latex mixture consisting of(a1) 50 to 95% by weight (expressed as a solid content) of a butadiene-styrene-vinylpyridine copolymer latex and(a2) 5 to 50% by weight (expressed as a solid content) of a carboxylated butadiene-styrene base copolymer latexand(B) 10 to 30 parts by weight of a resorcinformalin resin, which adheres fiber to rubber with good initial adhesion strength and/or without deterioration of adhesion strength after thermal history, and has good mechanical stability.
    Type: Grant
    Filed: August 27, 1987
    Date of Patent: August 29, 1989
    Assignee: Sumitomo Naugatuck Co., Ltd.
    Inventors: Yasushi Toyoda, Saburo Mishiba, Toshiyasu Nishioka