Abstract: A developer composition for resists which has a high dissolution rate (high developing sensitivity). The developer composition for resists is a developer composition for resists, comprising an organic quaternary ammonium base as a main component and a surfactant, said surfactant containing an anionic surfactant represented by the following general formula (I): wherein at least one member of R1 and R2 represents an alkyl or alkoxy group having 5 to 18 carbon atoms and any reminder member represents a hydrogen atom, or an alkyl or alkoxy group having 5 to 18 carbon atoms, and at least onemember of R3, R4 and R5 represents a group represented by the following general formula (II): [Chemical Formula 2] —SO3M??(II) wherein M represents a metal atom, and any reminder member represents a hydrogen atom or a group represented by the above general formula (II).

Abstract: To provide a developer composition for resists, capable of improving dimensional controllability of a resist pattern. The developer composition for resists comprises an organic quaternary ammonium base as a main component, said developer composition further comprising an anionic surfactant represented by the following general formula (I), and SO42?, the content of S42? being from 0.01 to 1% by mass. In the formula, at least one of R1 and R2 represents an alkyl or alkoxy group having 5 to 18 carbon atoms and the other one represents a hydrogen atom, or an alkyl or alkoxy group having 5 to 18 carbon atoms, and at least one of R3, R4 and R5 represents an ammonium sulfonate group or a sulfonic acid-substituted ammonium group and the others represent a hydrogen atom, an ammonium sulfonate group or a sulfonic acid-substituted ammonium group.

Abstract: A chemically amplified negative photoresist composition is used for the formation of thick films having a thickness of 20 to 150 ?m and includes (A) an alkali-soluble resin, (B) a compound which generates an acid upon irradiation with active light or radiant ray, and (C) a compound which serves as a crosslinking agent in the presence of an acid. The alkali-soluble resin (A) includes (a1) a novolak resin having a weight average molecular weight of from 5000 to 10000, and (a2) a polymer containing at least a hydroxystyrene constitutional unit and having a weight average molecular weight of less than or equal to 5000.

Abstract: There is provided a means capable of forming a high-accuracy resist pattern by the reaction of a resist composition with high sensitivity in a thin film photoresist layer used in the manufacture of a connecting terminal. Using a thick film photoresist layer laminate comprising a substrate (a), and a thick film photoresist layer (b) containing a resin whose alkali solubility changes due to the action of an acid, and an acid generator, which are laminated via a shield layer (c) which prevents the substrate (a) from contacting the thick film photoresist layer (b), a resist pattern is formed and a connecting terminal is then formed using a resist pattern.

Abstract: A chemically amplified negative photoresist composition is used for the formation of thick films having a thickness of 20 to 150 &mgr;m and includes (A) an alkali-soluble resin, (B) a compound which generates an acid upon irradiation with active light or radiant ray, and (C) a compound which serves as a crosslinking agent in the presence of an acid. The alkali-soluble resin (A) includes (a1) a novolak resin having a weight average molecular weight of from 5000 to 10000, and (a2) a polymer containing at least a hydroxystyrene constitutional unit and having a weight average molecular weight of less than or equal to 5000.

Abstract: An entry board for drilling small holes having a front surface layer made of aluminum or aluminum alloy to be disposed at the drilling inlet side and a back surface layer made of aluminum or aluminum alloy to be disposed at the drilling outlet side. The back surface layer is adhered or joined by clad rolling to said front surface layer. The hardness of the front surface layer is smaller than that of the back surface layer.

Abstract: An entry board for drilling small holes having a front surface layer made of aluminum or aluminum alloy to be disposed at the drilling inlet side and a back surface layer made of aluminum or aluminum alloy to be disposed at the drilling outlet side. The back surface layer is adhered or joined by clad rolling to said front surface layer. The hardness of the front surface layer is smaller than that of the back surface layer.