Patents by Inventor Yasushi Watanbe

Yasushi Watanbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting electronic components on a substrate
    Patent number: 7621042
    Abstract: A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes protrudes from one surface of the film substrate, and the other surfaces thereof are positioned in the positioning holes, respectively. Conductive patterns are formed on the other surface of the film substrate and are electrically connected to the other surfaces of the electronic components positioned in the positioning holes.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: November 24, 2009
    Assignee: Alps Electric Co., Ltd.
    Inventors: Yasushi Watanbe, Ikuo Hibino
  • Mounting structure of electronic components and mounting method thereof
    Publication number: 20060037777
    Abstract: A film substrate in a mounting structure of electronic components has positioning holes capable of positioning the electronic components passing therethrough. One surface of each of the electronic components which are inserted and positioned in the positioning holes protrudes from one surface of the film substrate, and the other surfaces thereof are positioned in the positioning holes, respectively. Conductive patterns are formed on the other surface of the film substrate and are electrically connected to the other surfaces of the electronic components positioned in the positioning holes.
    Type: Application
    Filed: July 11, 2005
    Publication date: February 23, 2006
    Inventors: Yasushi Watanbe, Ikuo Hibino