Abstract: A wiring member includes a wiring body and a pattern. The wiring body includes a plurality of wire-like transmission members and a base material. The plurality of wire-like transmission members are fixed to the base material in an aligned state, and the pattern is provided on the wiring body. The pattern makes a two-dimensional position of at least a part of a portion related to the base material recognizable in the wiring body.

Abstract: A semiconductor device includes a capacitor having a pair of electrodes opposite to each other through a dielectric layer, and an element other than the capacitor, both of which are formed on a semiconductor substrate. An ohmic electrode of the element and one of the electrodes of the capacitor are formed of the same metallic material.

Abstract: A plastic molding has a core and a skin-provided foam provided on an outer surface of the core. The core is provided with side walls, a foaming material receiving portion defined by the side walls, and through holes provided in the bottom surface of the foaming material receiving portion to extend through the core to connect the foaming material receiving portion to the outside of the core. The skin-provided foam includes a foam which is received in the foaming material receiving portion of the core to be adhered to the bottom surface thereof and enters the through holes of the core to constitute engaging portions with the core, and a skin member which covers the outer surface and side surfaces of the foam and is held at the end portions thereof between the foam and the side walls of the core. The disclosure is also directed to a method for producing such a plastic molding.

Abstract: A method for forming a V-shaped gate electrode on a semiconductor substrate includes the following steps: A first gate opening is formed in a first resist between a source and a drain formed on a semiconductor substrate, and dummy openings are formed near both sides of the first gate opening. By baking the first resist, convex portions thereof which rise steeply are formed between the first gate opening and the dummy openings. A second resist is formed to overlay the first resist convex portions and the first gate opening. The second resist is removed from the first gate opening, and a second gate opening larger than the first gate opening is formed in the second resist above the first gate opening. Metal for the V-shaped gate electrode is deposited through the second gate opening on the sides of the first resist convex portions rising steeply from the bottom of the first gate opening.

Abstract: A plastic molding has a core and a skin-provided foam provided on an outer surface of the core. The core is provided with side walls, a foaming material receiving portion defined by the side walls, and through holes provided in the bottom surface of the foaming material receiving portion to extend through the core to connect the foaming material receiving portion to the outside of the core. The skin-provided foam includes a foam which is received in the foaming material receiving portion of the core to be adhered to the bottom surface thereof and enters the through holes of the core to constitute engaging portions with the core, and a skin member which covers the outer surface and side surfaces of the foam and is held at the end portions thereof between the foam and the side walls of the core. The disclosure is also directed to a method for producing such a plastic molding.