Patents by Inventor Yasushi Yoshizawa

Yasushi Yoshizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-foamed polishing pad and polishing method therewith
    Publication number: 20030216111
    Abstract: A polishing pad made of a non-foamed resin material has surface roughness Ra in the range of 0.1-10 &mgr;m, or preferably 0.5-1.5 &mgr;m and variations in thickness less than 50 &mgr;m, or preferably less than 30 &mgr;m. Its Shore D hardness is greater than 60 degrees, or preferably 68 degrees. Its compressibility is less than 3%, or preferably less than 1% and its elasticity is greater than 30%, or preferably 50%, as measured by specified methods. Grooves may be formed over 30%-70%, or preferably 40%-60% of the total area of the polishing surface. When the polishing surface is subjected to a dressing process, its surface roughness Ra is restored to 0.1-10 &mgr;m, or preferably 0.5-1.5 &mgr;m.
    Type: Application
    Filed: May 20, 2002
    Publication date: November 20, 2003
    Applicant: Nihon Microcoating Co., Ltd.
    Inventors: Hisatomo Ohno, Jun Watanabe, Toshihiro Izumi, Yasushi Yoshizawa