Patents by Inventor Yasusi Simada

Yasusi Simada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate for mounting semiconductor chips
    Patent number: 6281450
    Abstract: A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: August 28, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Naoyuki Urasaki, Yasusi Simada, Yoshiyuki Tsuru, Akishi Nakaso, Itsuo Watanabe