Patents by Inventor Yasutaka Emoto
Yasutaka Emoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210273438Abstract: A heat-shrinkable tube according to an aspect of the present disclosure includes a base layer that is tubular and that covers outer peripheries of a plurality of electric wires, and a plurality of ridges that are formed on an inner peripheral surface of the base layer and that extend in an axial direction of the base layer.Type: ApplicationFiled: July 2, 2019Publication date: September 2, 2021Inventor: Yasutaka EMOTO
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Patent number: 10439384Abstract: The heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer. The base material layer contains a polyolefin-based resin. In the base material layer after being heated at 180° C. for 2 minutes, a melting-point peak temperature is 115° C. or higher and 128° C. or lower, a heat of fusion of a total resin component is 80 J/g or more and 150 J/g or less, a storage modulus at 120° C. is 4 MPa or more, a gel fraction is 40% by mass or more and 80% by mass or less, and a storage modulus at 180° C. is 0.5 MPa or more and less than 3.0 MPa. The polyolefin-based resin is preferably a mixture of a first polyolefin-based resin having a melting point of 125° C. or higher and 135° C. or lower and a second polyolefin-based resin having a melting point of lower than 125° C.Type: GrantFiled: March 22, 2016Date of Patent: October 8, 2019Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Shinya Nishikawa, Yasutaka Emoto, Mamoru Sekiguchi
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Patent number: 10239968Abstract: A pressure-sensitive adhesive sheet for covering according to an embodiment of the present invention includes a non-crosslinked rubber component having a maximum peak of the molecular weight distribution in the range of 50,000 to 3,000,000, an oil component having a maximum peak of the molecular weight distribution in the range of 1,000 to 20,000, and carbon black. The content of the non-crosslinked rubber component is 25% to 65% by mass, the content of the oil component is 35% to 75% by mass, and the content of the carbon black relative to 100 parts by mass of the total of the non-crosslinked rubber component and the oil component is 1 to 40 parts by mass.Type: GrantFiled: June 2, 2016Date of Patent: March 26, 2019Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Shinya Nishikawa, Yasutaka Emoto, Kazuto Shiina
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Publication number: 20180301886Abstract: The heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer. The base material layer contains a polyolefin-based resin. In the base material layer after being heated at 180° C. for 2 minutes, a melting-point peak temperature is 115° C. or higher and 128° C. or lower, a heat of fusion of a total resin component is 80 J/g or more and 150 J/g or less, a storage modulus at 120° C. is 4 MPa or more, a gel fraction is 40% by mass or more and 80% by mass or less, and a storage modulus at 180° C. is 0.5 MPa or more and less than 3.0 MPa. The polyolefin-based resin is preferably a mixture of a first polyolefin-based resin having a melting point of 125° C. or higher and 135° C. or lower and a second polyolefin-based resin having a melting point of lower than 125° C.Type: ApplicationFiled: March 22, 2016Publication date: October 18, 2018Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi YAMASAKI, Shinya NISHIKAWA, Yasutaka EMOTO, Mamoru SEKIGUCHI
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Patent number: 9985425Abstract: A multilayered heat-recoverable article according to the present invention includes a cylindrical base material layer and an adhesive layer disposed on an inner peripheral surface of the base material layer, in which the base material layer contains a polyethylene and an oxidation inhibitor, the adhesive layer contains an ethylene-vinyl acetate copolymer and an oxidation inhibitor, the oxidation induction temperature of the base material layer is 255° C. to 270° C., and the oxidation induction temperature of the adhesive layer is 255° C. or higher.Type: GrantFiled: August 8, 2014Date of Patent: May 29, 2018Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Yasutaka Emoto, Shouhei Okabe
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Publication number: 20170306063Abstract: A pressure-sensitive adhesive sheet for covering according to an embodiment of the present invention includes a non-crosslinked rubber component having a maximum peak of the molecular weight distribution in the range of 50,000 to 3,000,000, an oil component having a maximum peak of the molecular weight distribution in the range of 1,000 to 20,000, and carbon black. The content of the non-crosslinked rubber component is 25% to 65% by mass, the content of the oil component is 35% to 75% by mass, and the content of the carbon black relative to 100 parts by mass of the total of the non-crosslinked rubber component and the oil component is 1 to 40 parts by mass.Type: ApplicationFiled: June 2, 2016Publication date: October 26, 2017Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi YAMASAKI, Shinya NISHIKAWA, Yasutaka EMOTO, Kazuto SHIINA
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Patent number: 9692222Abstract: It is an object of the present invention to provide a heat-recoverable article which heat-shrinks in an appropriate temperature range, in which the occurrence of bloom and bleeding is small, and which has excellent resistance to copper-induced damage; and a wire splice and a wire harness each including the heat-recoverable article. A heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer, in which the base material layer contains an antioxidant and two or more polyolefin resins, the base material layer has one melting-point peak temperature, the melting-point peak temperature is 112° C. to 128° C., the heat of fusion of all of the resin components of the base material layer is 80 to 130 J/g, and the oxidation induction temperature of the base material layer is 265° C. to 280° C.Type: GrantFiled: October 7, 2014Date of Patent: June 27, 2017Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Ryota Fukumoto, Yasutaka Emoto
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Patent number: 9536637Abstract: A multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on the inner side of the base material layer 10. The adhesive layer 11 includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layer 11 is 300 Pa·s or more at a shear rate of 0.1 s?1 and 200 Pa·s or less at a shear rate of 100s?1.Type: GrantFiled: September 18, 2013Date of Patent: January 3, 2017Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Shinya Nishikawa, Ryouhei Fujita, Yasutaka Emoto
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Patent number: 9525281Abstract: A multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on an inner side of the base material layer 10. The adhesive layer 11 does not flow at a temperature of 135° C. and includes a thermoplastic resin and a viscosity characteristics modifier composed of at least one selected from the group consisting of silica, an organically treated layered silicate, and a deterioration inhibitor. In the case where the multilayered heat-recoverable article 1 is used to cover an insulated electrical wire which includes a conductor and a polyvinyl chloride layer provided on the outer periphery thereof, cracks do not occur in the polyvinyl chloride layer under heating conditions at 135° C. for 200 hours.Type: GrantFiled: September 18, 2013Date of Patent: December 20, 2016Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Shinya Nishikawa, Ryouhei Fujita, Yasutaka Emoto
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Patent number: 9524812Abstract: An object of the present invention is to provide a heat-recoverable article that thermally shrinks in a suitable temperature range and that does not easily split, and a wire splice and a wire harness that use the heat-recoverable article. The heat-recoverable article according to the present invention is a cylindrical, heat-recoverable article including a base layer. The base layer contains two or more polyolefin-based resins and a flame retardant, the base layer has a single melting-point peak temperature, the melting-point peak temperature is 112° C. or more and 128° C. or less, and a heat of fusion of the base layer is 60 J/g or more and 85 J/g or less. A heat of fusion of a total resin component of the base layer is preferably 80 J/g or more and 135 J/g or less.Type: GrantFiled: October 7, 2014Date of Patent: December 20, 2016Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Satoshi Yamasaki, Yasutaka Emoto
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Patent number: 9393755Abstract: An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.Type: GrantFiled: March 24, 2015Date of Patent: July 19, 2016Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC FINE POLYMER, INC.Inventors: Ryota Fukumoto, Satoshi Yamasaki, Yasutaka Emoto
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Publication number: 20160190787Abstract: It is an object of the present invention to provide a heat-recoverable article which heat-shrinks in an appropriate temperature range, in which the occurrence of bloom and bleeding is small, and which has excellent resistance to copper-induced damage; and a wire splice and a wire harness each including the heat-recoverable article. A heat-recoverable article according to the present invention has a cylindrical shape and includes a base material layer, in which the base material layer contains an antioxidant and two or more polyolefin resins, the base material layer has one melting-point peak temperature, the melting-point peak temperature is 112° C. to 128° C., the heat of fusion of all of the resin components of the base material layer is 80 to 130 J/g, and the oxidation induction temperature of the base material layer is 265° C. to 280° C.Type: ApplicationFiled: October 7, 2014Publication date: June 30, 2016Applicants: SUMITOMO ELECTRIC FINE POLYMER, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Satoshi YAMASAKI, Ryota FUKUMOTO, Yasutaka EMOTO
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Publication number: 20160089847Abstract: An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.Type: ApplicationFiled: March 24, 2015Publication date: March 31, 2016Inventors: Ryota FUKUMOTO, Satoshi YAMASAKI, Yasutaka EMOTO
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Publication number: 20160019999Abstract: An object of the present invention is to provide a heat-recoverable article that thermally shrinks in a suitable temperature range and that does not easily split, and a wire splice and a wire harness that use the heat-recoverable article. The heat-recoverable article according to the present invention is a cylindrical, heat-recoverable article including a base layer. The base layer contains two or more polyolefin-based resins and a flame retardant, the base layer has a single melting-point peak temperature, the melting-point peak temperature is 112° C. or more and 128° C. or less, and a heat of fusion of the base layer is 60 J/g or more and 85 J/g or less. A heat of fusion of a total resin component of the base layer is preferably 80 J/g or more and 135 J/g or less.Type: ApplicationFiled: October 7, 2014Publication date: January 21, 2016Inventors: Satoshi YAMASAKI, Yasutaka EMOTO
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Publication number: 20150357810Abstract: It is an object of the present invention to provide a multilayered heat-recoverable article in which the occurrence of bloom and bleeding is small, which has excellent resistance to copper-induced damage, and which is easy to produce; and a wire splice and a wire harness each including the multilayered heat-recoverable article. A multilayered heat-recoverable article according to the present invention includes a cylindrical base material layer and an adhesive layer disposed on an inner peripheral surface of the base material layer, in which the base material layer contains a polyethylene and an oxidation inhibitor, the adhesive layer contains an ethylene-vinyl acetate copolymer and an oxidation inhibitor, the oxidation induction temperature of the base material layer is 255° C. to 270° C., and the oxidation induction temperature of the adhesive layer is 255° C. or higher.Type: ApplicationFiled: August 8, 2014Publication date: December 10, 2015Applicants: SUMITOMO ELECTRIC FINE POLYMER, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Satoshi YAMASAKI, Yasutaka EMOTO, Shouhei OKABE
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Publication number: 20150333494Abstract: Provided are a multilayered heat-recoverable article which can suppress deterioration of a PVC insulated wire and flow of an adhesive layer and which is suitable for appropriately protecting the PVC insulated wire; and a wire splice and a wire harness, each including the multilayered heat-recoverable article. According to the present invention, a multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on an inner side of the base material layer 10. The adhesive layer 11 does not flow at a temperature of 135° C. and includes a thermoplastic resin and a viscosity characteristics modifier composed of at least one selected from the group consisting of silica, an organically treated layered silicate, and a deterioration inhibitor.Type: ApplicationFiled: September 18, 2013Publication date: November 19, 2015Applicants: SUMITOMO ELECTRIC FINE POLYMER, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Satoshi YAMASAKI, Shinya NISHIKAWA, Ryouhei FUJITA, Yasutaka EMOTO
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Publication number: 20150068800Abstract: Provided are a multilayered heat-recoverable article which can be used for many types of adherend and which is suitable for improving the convenience of the user, and a wire harness and a wire splice, each including the multilayered heat-recoverable article. According to the present invention, a multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on the inner side of the base material layer 10. The adhesive layer 11 includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layer 11 is 300 Pa·s or more at a shear rate of 0.1 s?1 and 200 Pa·s or less at a shear rate of 100 s?1.Type: ApplicationFiled: September 18, 2013Publication date: March 12, 2015Applicants: Sumitomo Electric Industries, Ltd., Sumitomo Electric Fine Polymer, Inc.Inventors: Satoshi Yamasaki, Shinya Nishikawa, Ryouhei Fujita, Yasutaka Emoto
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Publication number: 20150004408Abstract: Provided is a thermally restorable article which has a good filling property when thermally shrunk to improve adhesiveness with a base to be treated, and in which the variation in the thickness of an adhesive layer during extrusion molding can be reduced. A multilayer thermally restorable article includes an adhesive layer composed of an adhesive composition that contains a thermoplastic resin having a melt flow rate of 15 g/10 min or more and 1,000 g/10 min or less at 190° C. and at a load of 2.16 kg, and an organically treated layered silicate, and that has a shear viscosity of 1,000 Pa·s or more at a temperature of 150° C. and at a shear rate of 0.1 s?1; and an outer layer disposed on an outer periphery of the adhesive layer. More preferably, a shear viscosity of the adhesive composition at a temperature of 150° C. and at a shear rate of 100 s?1 is 200 Pa·s or less.Type: ApplicationFiled: September 16, 2013Publication date: January 1, 2015Inventors: Satoshi Yamasaki, Shinya Nishikawa, Yasutaka Emoto, Ryouhei Fujita