Abstract: A method of processing a substrate that includes: forming an infrared (IR) absorbing separation layer over a first substrate; forming one or more layers over the IR absorbing separation layer; bonding the first substrate and a second substrate at a bonding interface between the one or more layers and the second substrate using a direct bonding technique to form a wafer stack; exposing the wafer stack to an infrared (IR) light irradiation to separate the first substrate from the one or more layers.

Abstract: A polyimide of the present invention contains an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride and 3?,4,4?-biphenyl-tetracarboxylic acid dianhydride as acid dianhydrides, and contains 3,3?-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine as diamines. A polyimide film of the present invention contains the polyimide resin. For example, the polyimide film is obtained by applying a polyimide solution, which is obtained by dissolving the polyimide resin in an organic solvent, onto a substrate, and removing the solvent.

Abstract: A polyimide resin has an acid dianhydride-derived structure and a diamine-derived structure, the acid dianhydride contains an acid dianhydride represented by the general formula (1) and a fluorine-containing aromatic acid dianhydride, and the diamine contains a fluoroalkyl-substituted benzidine. In the general formula (1), n is an integer of 1 or more, and R1 to R4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a perfluoroalkyl group having 1 to 20 carbon atoms. The content of the acid dianhydride represented by the general formula (1) may be 10 to 65 mol %, and the content of the fluorine-containing aromatic acid dianhydride may be 30 to 80 mol %, based on 100 mol % of the total of the acid dianhydride.

Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

Abstract: A polyimide has structures derived from acid dianhydrides and structures derived from diamines. The polyimide of the present invention contains, at a ratio in a predetermined range, an alicyclic acid dianhydride and a fluorine-containing aromatic acid dianhydride as acid dianhydrides, and contains, at a ratio in a predetermined range, 3,3?-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine as diamines. The polyimide of the present invention has an excellent solubility in a solvent. Further, the polyimide of the present invention has less coloration, an excellent transparency, and an excellent mechanical strength.

Abstract: An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m2 and a loop stiffness value of 0.45 g/cm or more.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4 H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

Abstract: A reverse osmosis treatment apparatus includes a membrane unit including an osmosis membrane module. The membrane unit includes a plurality of banks connected in series, each bank including an osmosis membrane module. At least one of the banks includes a treatment water pipe valve and a concentrated water pipe valve, and a bypass pipe capable of diverting the water to be treated, which is to be supplied to the bank, around the bank and draining the water to be treated and a chemical cleaning pipe capable of supplying the reverse osmosis membrane module disposed in the bank with chemical cleaning water are connected. A reverse osmosis treatment method is for cleaning intermittently a bank having the treatment water pipe valve and the concentrated water pipe valve while continuing the reverse osmosis treatment using the remaining bank.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m2 and a loop stiffness value of 0.

Abstract: A produced water treatment system includes: a raw water flow passage to allow produced water to flow therethrough; a desalination flow passage connected to the raw water flow passage, and connected to a membrane distillation apparatus which removes a salt in the produced water flowing in from the raw water flow passage; and a bypass flow passage connected to the desalination flow passage and configured to supply the produced water to desalinated water obtained by desalination by the membrane distillation apparatus.

Abstract: In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.