Abstract: A polarization imaging unit 20 acquires a polarized image including polarization pixels with a plurality of polarization directions. An information compression unit 40 sets reference image information based on polarized image information of reference polarization pixels with at least a plurality of polarization directions in the polarized image and generates difference information between the polarized image information of each of polarization pixels different from the reference polarization pixels in the polarized image and the reference image information. In addition, the information compression unit 40 reduces the amount of information of the difference information generated for each of the polarization pixels with the plurality of polarization directions to generate compressed image information including the reference image information and the difference information with the reduced amount of information.

Abstract: An information processing apparatus according to an embodiment of the present technology includes a detection unit, an estimation unit, and a prediction unit. The detection unit detects a target object from an input image. The estimation unit estimates a posture of the detected target object. The prediction unit predicts an action of the target object on a basis of the estimated posture.

Abstract: A polyimide of the present invention contains an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride and 3?,4,4?-biphenyl-tetracarboxylic acid dianhydride as acid dianhydrides, and contains 3,3?-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine as diamines. A polyimide film of the present invention contains the polyimide resin. For example, the polyimide film is obtained by applying a polyimide solution, which is obtained by dissolving the polyimide resin in an organic solvent, onto a substrate, and removing the solvent.

Abstract: A polyimide resin has an acid dianhydride-derived structure and a diamine-derived structure, the acid dianhydride contains an acid dianhydride represented by the general formula (1) and a fluorine-containing aromatic acid dianhydride, and the diamine contains a fluoroalkyl-substituted benzidine. In the general formula (1), n is an integer of 1 or more, and R1 to R4 are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a perfluoroalkyl group having 1 to 20 carbon atoms. The content of the acid dianhydride represented by the general formula (1) may be 10 to 65 mol %, and the content of the fluorine-containing aromatic acid dianhydride may be 30 to 80 mol %, based on 100 mol % of the total of the acid dianhydride.

Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

Abstract: A polyimide has structures derived from acid dianhydrides and structures derived from diamines. The polyimide of the present invention contains, at a ratio in a predetermined range, an alicyclic acid dianhydride and a fluorine-containing aromatic acid dianhydride as acid dianhydrides, and contains, at a ratio in a predetermined range, 3,3?-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine as diamines. The polyimide of the present invention has an excellent solubility in a solvent. Further, the polyimide of the present invention has less coloration, an excellent transparency, and an excellent mechanical strength.

Abstract: An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m2 and a loop stiffness value of 0.45 g/cm or more.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material is provided herein. In some embodiments, the insulating coating material comprises an insulating film comprising a polyimide resin, wherein the insulating film, when measuring a tensile elasticity in accordance with ASTM D882, having a stress at 5% strain of 180 MPa or greater and a stress at 15% strain of 225 MPa or greater, wherein the stress at 15% strain is greater than the stress at 5% strain.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4 H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.

Abstract: A reverse osmosis treatment apparatus includes a membrane unit including an osmosis membrane module. The membrane unit includes a plurality of banks connected in series, each bank including an osmosis membrane module. At least one of the banks includes a treatment water pipe valve and a concentrated water pipe valve, and a bypass pipe capable of diverting the water to be treated, which is to be supplied to the bank, around the bank and draining the water to be treated and a chemical cleaning pipe capable of supplying the reverse osmosis membrane module disposed in the bank with chemical cleaning water are connected. A reverse osmosis treatment method is for cleaning intermittently a bank having the treatment water pipe valve and the concentrated water pipe valve while continuing the reverse osmosis treatment using the remaining bank.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

Abstract: An insulating coating material including an insulating film, and an adhesion layer on at least one side of an insulating film. The insulating film satisfies Formula (1) a=k×b3 . . . Formula (1) where a is a loop stiffness value in g/cm of the insulating film, b is a thickness in ?m of the insulating film, and k is 0.000105 or more.

Abstract: An insulating coating material including a polyimide film, and an adhesion layer on at least one side of a polyimide film. The polyimide film has a weight of 23.5 g or less per 1 m2 and a loop stiffness value of 0.

Abstract: A produced water treatment system includes: a raw water flow passage to allow produced water to flow therethrough; a desalination flow passage connected to the raw water flow passage, and connected to a membrane distillation apparatus which removes a salt in the produced water flowing in from the raw water flow passage; and a bypass flow passage connected to the desalination flow passage and configured to supply the produced water to desalinated water obtained by desalination by the membrane distillation apparatus.

Abstract: In the present invention, (i) a polyamic acid solution for forming a thermoplastic polyimide layer to be in no contact with a support contains no chemical dehydrating agent or imidization catalyst, (ii) a polyamic acid solution for forming a thermoplastic polyimide layer to be in contact with the support contains an imidization catalyst, and (iii) a polyamic acid solution for forming a non-thermoplastic polyimide layer contains a chemical dehydrating agent and an imidization catalyst. This arrangement eliminates a property difference between the thermoplastic polyimide layers.

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.