Patents by Inventor Yasutaka Miyata

Yasutaka Miyata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid resin composition, semi-conductor device, and process of fabricating the same
    Patent number: 8106523
    Abstract: A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: January 31, 2012
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Naoki Kanagawa, Yasutaka Miyata
  • LIQUID RESIN COMPOSITION, SEMI-CONDUCTOR DEVICE, AND PROCESS OF FABRICATING THE SAME
    Publication number: 20090261484
    Abstract: A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part.
    Type: Application
    Filed: May 5, 2009
    Publication date: October 22, 2009
    Inventors: Naoki Kanagawa, Yasutaka Miyata