Abstract: A sensor according to a first embodiment of the present invention includes a flow channel to permit passage of a specimen, a first detection part that is located in the flow channel and has a first ligand specifically bindable to a first material in the specimen, and a second detection part that is located downstream of the first detection part in the flow channel and has a second ligand specifically bindable to the first material and/or a second material in the specimen.

Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

Abstract: A sensor apparatus includes a first cover member; a detection element including an element substrate located on the first cover member, and a detection portion configured to detect an analyte, the detection portion being located on the element substrate; a terminal located on the first cover member and electrically connected to the detection element; an intermediate cover member located on the first cover member and having a space with the detection element; a filler member located in the space between the detection element and the intermediate cover member; a second cover member configured to cover at least a part of the detection element and joined to at least one of the first cover member and the intermediate cover member; an inlet into which the analyte flows; and a flow passage which is continuous with the inlet, and extends at least to the detection portion.

Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

Abstract: An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.

Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

Abstract: A sensor according to a first embodiment of the present invention includes a flow channel to permit passage of a specimen, a first detection part that is located in the flow channel and has a first ligand specifically bindable to a first material in the specimen, and a second detection part that is located downstream of the first detection part in the flow channel and has a second ligand specifically bindable to the first material and/or a second material in the specimen.

Abstract: A sensor which uses a detection element such as a surface acoustic wave element, and includes a flow passage for a specimen is provided. A sensor includes a substrate; a detection element located on the substrate and having a detection portion which detects an object to be detected contained in a specimen, in an upper surface thereof; and a flow passage structure located on the substrate and covering the detection portion with a space. The flow passage structure has an inlet for the specimen, a flow passage continuing from the inlet, and a space which continues from an end portion of the flow passage closer to the detection element and is located above the detection portion, and a bottom surface of the flow passage has, on the end portion of the flow passage closer to the detection element, a notched portion whose width gradually decreases toward an upstream of the flow passage.

Abstract: A sensor apparatus includes a first cover member; a detection element including an element substrate located on the first cover member, and a detection portion configured to detect an analyte, the detection portion being located on the element substrate; a terminal located on the first cover member and electrically connected to the detection element; an intermediate cover member located on the first cover member and having a space with the detection element; a filler member located in the space between the detection element and the intermediate cover member; a second cover member configured to cover at least a part of the detection element and joined to at least one of the first cover member and the intermediate cover member; an inlet into which the analyte flows; and a flow passage which is continuous with the inlet, and extends at least to the detection portion.

Abstract: An acoustic wave device and an electronic component are disclosed. The acoustic wave device includes a substrate, excitation electrodes on the substrate and a cover. The cover comprises a frame member on the substrate, and a lid member. The frame member surrounds the excitation electrodes and includes an inner wall, top surface and an outer wall. The lid member is disposed on the top surface, and includes first and second surfaces opposite to each other, and a descending part on the second surface. The second surface faces the substrate. The descending part extends downward from the second surface, and covers at least a part of the inner wall or at least a part of the outer wall. The electronic component includes the acoustic wave device on a mounting substrate via an electrically conductive bonding member, and molding resin covering the device.

Abstract: An electronic component has a mounting board, a bump located on a mounting surface of the mounting board, a SAW device located on the bump and connected to the bump. The SAW device has an element substrate, an excitation electrode located on the first primary surface of the element substrate, a pad located on the first primary surface and connected to the excitation electrode, and a cover located above the excitation electrode and formed with a pad exposure portion on the pad. Further, the SAW device makes the top surface of the cover face the mounting surface, makes the bump be located in the pad exposure portion, and makes the pad abut against the bump.