Abstract: A cooler has a cooling main body portion that includes: a cooling wall in the Y direction including a first face with a heat generator thereon, and a second face opposite thereto; first and second flow path extending in the Y direction, the first flow path allowing refrigerant to flow in, and the second flow path allowing the refrigerant to flow out; cooling flow paths with a part of a wall surface comprising the second face; a partition spaced from the cooling wall in the Z direction, separating the first and the second flow paths from the cooling flow paths; and a first narrowing portion at a communication portion between a cooling flow path and the first flow path. The cooling flow paths are positioned between the first and flow paths and the cooling wall, and cause the first and the second flow path to communicate in the X direction.

Abstract: A semiconductor apparatus includes: a semiconductor module; a cooler including flow paths through which a refrigerant flows; a casing including a bottom surface; at least one first fixing member fixing the cooler to the bottom surface; and at least one second fixing member fixing the cooler to the bottom surface. The cooler includes: an outer surface directed to the bottom surface of the casing; an inner surface that is a part of wall surfaces of the flow paths on an opposite side to the outer surface; an outer wall to which the at least one first fixing member is connected; and an outer wall that is on an opposite side to the outer wall and to which the at least one second fixing member is connected. The semiconductor module is positioned between the bottom surface of the casing and the outer surface of the cooler, and is pressed by these two surfaces.

Abstract: A cooler includes a main body extending in the Y direction. The main body includes: (i) an outer wall including an outer surface on which a semiconductor module is to be arranged, and an inner surface; (ii) an inflow path extending in the Y direction, and having an end into which a refrigerant flows; (iii) an outflow path extending in the Y direction, and having an end from which the refrigerant flows out; and (iv) cooling flow paths having the inner surface as a part of a wall surface. The cooling flow paths are arrayed in the Y direction, extend in the X direction, and are positioned between the inflow and outflow paths and the outer wall in the Z direction. Each of the cooling flow paths causes the inflow path and the outflow path to communicate with each other in the X direction.

Abstract: A cooler includes: a cooling wall including a first surface and a second surface; a first path extending in a first direction and having an inlet for a refrigerant; a second path extending in the first direction and having an outlet for the refrigerant; a cooling path causing the first path to communicate with the second path in a second direction intersecting the first direction; a partition spaced from the cooling wall in a third direction perpendicular to the first surface, separating the first and second paths from the cooling paths, and including a third surface constituting a part of a wall surface of the first path, the third surface including a first portion and a second portion differing from the first portion in position in the third direction. The first path includes a first gas retaining space defined by the first and second portions.

Abstract: A fuel cell system includes a heater and a radiator provided in a waste heat recovery circulation line. The heater converts the surplus power of a solid oxide fuel cell into heat when a grid power network and the solid oxide fuel cell switch from the inter-connected state to the disconnected state. The radiator controls the temperature of the heat produced in the heater.

Abstract: An electronic expansion valve (50) includes a small hole (54a) that expands a refrigerant, a valve body (55c) that opens and closes the small hole, an elastic member (70) that urges the valve body to close the small hole, and a solenoid (61) that suctions the valve body to open the small hole, and expands the refrigerant by opening and closing the valve body. The elastic member is a disc spring in which a plurality of slits (73) formed in a spiral form is provided at mutually equal pitches on the perimeter. Therefore, there is no need for a guide, the occurrence of sludge due to sliding is suppressed, and the electronic expansion valve operates stably over a long period.

Abstract: An electronic expansion valve (50) includes a small hole (54a) that expands a refrigerant, a valve body (55c) that opens and closes the small hole, an elastic member (70) that urges the valve body to close the small hole, and a solenoid (61) that suctions the valve body to open the small hole, and expands the refrigerant by opening and closing the valve body. The elastic member is a disc spring in which a plurality of slits (73) formed in a spiral form is provided at mutually equal pitches on the perimeter. Therefore, there is no need for a guide, the occurrence of sludge due to sliding is suppressed, and the electronic expansion valve operates stably over a long period.