Patents by Inventor Yasutaka Shimizu

Yasutaka Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10276464
    Abstract: Provided is a technique of reducing detachment of a sealing resin in a semiconductor device, thereby achieving an increased improvement in lifetime of the semiconductor device. The semiconductor device includes the following: an insulating substrate; a metal block disposed on the upper surface of the insulating substrate; a semiconductor element mounted on the upper surface of the metal block; a case enclosing the semiconductor element, the metal block, and the insulating substrate; and a sealing resin sealing the semiconductor element and the metal block. The metal block includes at least one groove on a surface of the metal block, the surface being in contact with the sealing resin. The opening of the at least one groove has a width narrower than a width of the bottom surface of the at least one groove.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: April 30, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasutaka Shimizu, Takuya Takahashi, Yoshitaka Otsubo
  • Publication number: 20190074238
    Abstract: Provided is a technique for improving product attachment. In a semiconductor device, the following expression is satisfied by an angle A formed by an imaginary line connecting two attachment holes together and an imaginary line connecting together a lowest point of one of two projections positioned in a surrounding portion of one of the two attachment holes and a contact point between a bulge and a heat sink, with a screw fastened to the heat sink through the one attachment hole, where M represents a vertical direction between the lower end of a body and the lower end of a case, where W represents a bulge amount of the bulge, where T represents a height of the projection, where L represents a horizontal distance from the outer peripheral end of the case to the outer peripheral end of the heat dissipation plate: 0<A<arctan ((M+W?T)/L).
    Type: Application
    Filed: June 11, 2018
    Publication date: March 7, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuya OKADA, Hiroki MURAOKA, Koichi MASUDA, Yasutaka SHIMIZU, Shoji IZUMI
  • Patent number: 10117335
    Abstract: A power module includes a power semiconductor device, and a chip component arranged on first and second circuit patterns that are electrically connected to the power semiconductor device, and arranged so as to bridge the first and second circuit patterns. The chip component is arranged so that first and second electrodes are respectively positioned on the first and second circuit patterns, and the first and second electrodes and the first and second circuit patterns are respectively joined with solder layers. Between a lower surface of the chip component and the first circuit pattern and between the lower surface of the chip component and the second circuit pattern, two spacers are provided in parallel with each other respectively at positions close to the first and second electrodes. The solder layers do not exist on an inner side of the two spacers in parallel with each other.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: October 30, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takuya Takahashi, Yasutaka Shimizu
  • Publication number: 20180269120
    Abstract: Provided is a technique of reducing detachment of a sealing resin in a semiconductor device, thereby achieving an increased improvement in lifetime of the semiconductor device. The semiconductor device includes the following: an insulating substrate; a metal block disposed on the upper surface of the insulating substrate; a semiconductor element mounted on the upper surface of the metal block; a case enclosing the semiconductor element, the metal block, and the insulating substrate; and a sealing resin sealing the semiconductor element and the metal block. The metal block includes at least one groove on a surface of the metal block, the surface being in contact with the sealing resin. The opening of the at least one groove has a width narrower than a width of the bottom surface of the at least one groove.
    Type: Application
    Filed: December 14, 2017
    Publication date: September 20, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasutaka SHIMIZU, Takuya TAKAHASHI, Yoshitaka OTSUBO
  • Patent number: 9960126
    Abstract: According to the present invention, a semiconductor device includes a heat spreader, a semiconductor chip fixed to a mounting surface of the heat spreader via a bonding member and sealing resin that covers the heat spreader and the semiconductor chip, wherein a groove is formed on the mounting surface around the semiconductor chip, a length between the semiconductor chip and the groove is equal to or greater than a depth of the groove, and the bonding member is not provided on at least part of a region of the mounting surface between the semiconductor chip and the groove.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: May 1, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Manabu Matsumoto, Yoshitaka Otsubo, Yasutaka Shimizu
  • Publication number: 20180025993
    Abstract: According to the present invention, a semiconductor device includes a heat spreader, a semiconductor chip fixed to a mounting surface of the heat spreader via a bonding member and sealing resin that covers the heat spreader and the semiconductor chip, wherein a groove is formed on the mounting surface around the semiconductor chip, a length between the semiconductor chip and the groove is equal to or greater than a depth of the groove, and the bonding member is not provided on at least part of a region of the mounting surface between the semiconductor chip and the groove.
    Type: Application
    Filed: February 13, 2017
    Publication date: January 25, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Manabu MATSUMOTO, Yoshitaka OTSUBO, Yasutaka SHIMIZU
  • Publication number: 20180005923
    Abstract: A semiconductor device includes: a circuit pattern, at least one or more wires joined thereto, an electrode terminal joining thereto, and a semiconductor element. The electrode terminal includes a horizontally extending portion extending along a main surface and connected to the wire, and a bent portion at which an extending direction of the electrode terminal is changed relative to the horizontally extending portion. Each of the wires has joint portions at which each of the wires and the circuit pattern are joined to each other. In a plan view, the joint portions are located on an outside of a portion where each of the wires and the electrode terminal overlap each other.
    Type: Application
    Filed: March 30, 2017
    Publication date: January 4, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasutaka SHIMIZU, Yoshitaka OTSUBO, Mituharu TABATA
  • Patent number: 9859195
    Abstract: A semiconductor device includes: a circuit pattern, at least one or more wires joined thereto, an electrode terminal joining thereto, and a semiconductor element. The electrode terminal includes a horizontally extending portion extending along a main surface and connected to the wire, and a bent portion at which an extending direction of the electrode terminal is changed relative to the horizontally extending portion. Each of the wires has joint portions at which each of the wires and the circuit pattern are joined to each other. In a plan view, the joint portions are located on an outside of a portion where each of the wires and the electrode terminal overlap each other.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: January 2, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasutaka Shimizu, Yoshitaka Otsubo, Mituharu Tabata
  • Patent number: 9769990
    Abstract: A power tool includes: a power source (7); a tip tool (2); two switches (SW1,SW2); and a control unit (6e). The tip tool (2) is configured to be driven by the power source (7). The two switches (SW1,SW2) are configured to be turned on for activating the power source (7). The control unit (6e) is configured to control the power source (7) in accordance with on/off of the two switches (SW1,SW2), and operate if at least one of the two switches (SW1,SW2) is turned on.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: September 26, 2017
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Toshiaki Koizumi, Kazutaka Iwata, Yasutaka Shimizu
  • Patent number: 9555537
    Abstract: A casing of a hedge clipper which is a portable tool is provided with a power source housing in which an electric motor is housed and a main handle held by a worker, and blades serving as a tip tool are provided to the casing. An operation display panel is provided on the main handle, and a driving information display unit which displays a battery remaining capacity and a rotation speed of an electric motor as a plurality of pieces of driving information is provided on the operation display panel. The selection of the information to be displayed is switched by the operation of an operation switch unit provided in the operation display panel.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: January 31, 2017
    Assignee: HITACHI KOKI CO., LTD.
    Inventors: Kazutaka Iwata, Yasutaka Shimizu, Shogo Shibata
  • Patent number: 9486867
    Abstract: A chainsaw having improved cutting workability is provided. A chainsaw is used to cut an object to be worked by a saw chain. A chainsaw main body is provided with an electric motor and a sprocket, and a guide bar around which the saw chain is wound is provided on the chainsaw main body. The guide bar is attached to the chainsaw main body by a screw member serving as an attaching member. A load sensor detects whether or not the guide bar is attached to the chainsaw main body. Rotation of the saw chain is prohibited based upon a signal from the load sensor when the guide bar is not attached to the chainsaw main body.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: November 8, 2016
    Assignee: HITACHI KOKI CO., LTD.
    Inventors: Yasuo Etou, Satoru Matsuno, Kouji Sagawa, Miyoji Onose, Yasutaka Shimizu, Ai Nakayama
  • Patent number: 9381665
    Abstract: A chainsaw in which a remaining amount of chain oil to be supplied to a saw chain can be easily checked is provided. In a chainsaw 1 including: a saw chain 6 driven by a motor embedded in a main body; and an oil tank 11 in which the chain oil to be supplied to the saw chain 6 in wood cutting process is stored, an illumination unit (LED 15) is provided in vicinity of the oil tank 11. In this manner, the chain oil of the oil tank 11 positioned on a left side of the LED 15 can be illuminated. This illumination unit is configured to be used also as an illuminating device for illuminating the vicinity of the saw chain 6, that is, an area indicated by dotted lines from 21c to 21d. According to the present invention, in a dark location, the remaining amount of the chain oil can be checked, and besides, a positional relationship among the chainsaw 1 main body, the saw chain 6, and the periphery thereof can be easily visually checked, so that the working efficiency can be improved.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: July 5, 2016
    Assignee: HITACHI KOKI CO., LTD.
    Inventors: Miyoji Onose, Kouji Sagawa, Satoru Matsuno, Yasuo Etou, Ai Nakayama, Yasutaka Shimizu
  • Patent number: 9372435
    Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: June 21, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventors: Hiroya Abe, Masaki Watanabe, Yasutaka Shimizu
  • Patent number: 9372436
    Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: June 21, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventors: Hiroya Abe, Masaki Watanabe, Yasutaka Shimizu
  • Publication number: 20150346631
    Abstract: A toner carrier includes a metal core, a barrel formed on an outer circumference of the metal core and including at least an elastic layer, and a coating formed on outer circumferences of both ends of the barrel. The coating has a thickness and a width of an outer circumference of the coating is different from a width of an inner circumference of the coating. The width is from an end surface of the barrel along an axis of the barrel, and the width of the outer circumference is larger than the width of the inner circumference so that the end surface of the coating is reversely inclined.
    Type: Application
    Filed: August 11, 2015
    Publication date: December 3, 2015
    Applicant: RICOH COMPANY, LTD.
    Inventors: Hiroya ABE, Masaki WATANABE, Yasutaka SHIMIZU
  • Publication number: 20150321377
    Abstract: A chainsaw in which a remaining amount of chain oil to be supplied to a saw chain can be easily checked is provided. In a chainsaw 1 including: a saw chain 6 driven by a motor embedded in a main body; and an oil tank 11 in which the chain oil to be supplied to the saw chain 6 in wood cutting process is stored, an illumination unit (LED 15) is provided in vicinity of the oil tank 11. In this manner, the chain oil of the oil tank 11 positioned on a left side of the LED 15 can be illuminated. This illumination unit is configured to be used also as an illuminating device for illuminating the vicinity of the saw chain 6, that is, an area indicated by dotted lines from 21c to 21d. According to the present invention, in a dark location, the remaining amount of the chain oil can be checked, and besides, a positional relationship among the chainsaw 1 main body, the saw chain 6, and the periphery thereof can be easily visually checked, so that the working efficiency can be improved.
    Type: Application
    Filed: February 12, 2013
    Publication date: November 12, 2015
    Inventors: Miyoji ONOSE, Kouji SAGAWA, Satoru MATSUNO, Yasuo ETOU, Ai NAKAYAMA, Yasutaka SHIMIZU
  • Publication number: 20150289451
    Abstract: A power tool includes: a power source (7); a tip tool (2); two switches (SW1,SW2); and a control unit (6e). The tip tool (2) is configured to be driven by the power source (7). The two switches (SW1,SW2) are configured to be turned on for activating the power source (7). The control unit (6e) is configured to control the power source (7) in accordance with on/off of the two switches (SW1,SW2), and operate if at least one of the two switches (SW1,SW2) is turned on.
    Type: Application
    Filed: October 31, 2013
    Publication date: October 15, 2015
    Inventors: Toshiaki Koizumi, Kazutaka Iwata, Yasutaka Shimizu
  • Patent number: 9155362
    Abstract: A clip includes a male member having a head portion and a shaft portion, and a female member having a base portion, a fitting portion into an attachment hole for one attachment object, and a reception hole for the shaft portion. The clip is formed to hold another attachment object between the head portion and the base portion. An inside of the reception hole of the female member includes a first sliding contact portion relative to a first cam portion formed at an end of the shaft portion, an engagement concave portion relative to an engagement protrusion formed in a middle of the shaft portion, and a second sliding contact portion located at a hole opening of the reception hole and relative to a second cam portion formed at the engagement protrusion. The shaft portion can be inserted into and released from the female member.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: October 13, 2015
    Assignee: NIFCO INC.
    Inventors: Yasutaka Shimizu, Yuki Hirano
  • Publication number: 20150173466
    Abstract: A clip includes a male member having a head portion and a shaft portion, and a female member having a base portion, a fitting portion into an attachment hole for one attachment object, and a reception hole for the shaft portion. The clip is formed to hold another attachment object between the head portion and the base portion. An inside of the reception hole of the female member includes a first sliding contact portion relative to a first cam portion formed at an end of the shaft portion, an engagement concave portion relative to an engagement protrusion formed in a middle of the shaft portion, and a second sliding contact portion located at a hole opening of the reception hole and relative to a second cam portion formed at the engagement protrusion. The shaft portion can be inserted into and released from the female member.
    Type: Application
    Filed: November 7, 2012
    Publication date: June 25, 2015
    Inventors: Yasutaka Shimizu, Yuki Hirano
  • Patent number: D736060
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: August 11, 2015
    Assignee: NIFCO INC.
    Inventors: Yasutaka Shimizu, Yoshimi Arai