Abstract: An inspection apparatus and method outputs an accurate matching position even if a search image contains a pattern similar to a template. An image search unit includes a relative position comparing unit which compares the relative position of a template in a template selection image with the relative position of a location currently being searched for in a search image and outputs the amount of position mismatch between the relative positions. A matching position determining unit determines a matching position by taking into consideration the amount of position mismatch in addition to search image similarity distribution information.

Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.

Abstract: A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.

Abstract: A bill recognizing and counting apparatus includes a feeding and transporting mechanism; a line sensor to scan an image of the bills; a denomination determination table in which denomination recognition data is registered for at least one currency; a denomination recognizing unit that recognizes a denomination of the currency by referring to the table; a processing-mode switching unit that switches between a denomination mode and a different currency recognition mode; a different-currency recognizing unit that compares a difference in size between a first bill and each bill of a second bill and thereafter with an allowable range, and recognizes whether the each bill of the second bill and thereafter is of the same denomination as the first bill; and a control unit that guides the bill being determined as a different denomination to a rejecting unit or stops the feeding and transporting mechanism.

Abstract: Although there has been a method for evaluating pattern shapes of electronic devices by using, as a reference pattern, design data or a non-defective pattern, the conventional method has a problem that the pattern shape cannot be evaluated with high accuracy because of the difficulty in defining an exact shape suitable for the manufacturing conditions of the electronic devices. The present invention provides a shape evaluation method for circuit patterns of electronic devices, the method including a means for generating contour distribution data of at least two circuit patterns from contour data sets on the circuit patterns; a means for generating a reference pattern used for the pattern shape evaluation, from the contour distribution data; and a means for evaluating the pattern shape by comparing each evaluation target pattern with the reference pattern.

Abstract: A pattern matching apparatus comprising: means for storing photographed image data of a semiconductor device; means for storing CAD data of said semiconductor device; an information input means for inputting information on the white band width contained in said image data; a pattern extracting means for extracting a pattern on the semiconductor device from said image data by using the white band width information; and a matching means for matching said pattern with the CAD data.

Abstract: Solving means is configured of a signal input interface, a data calculation unit, and a signal output interface. The signal input interface allows image data which is obtained by photographing hole patterns, and CAD data which corresponds to hole patterns included in the image data, to be inputted.

Abstract: There is provided a pattern inspection apparatus that is capable of detecting a defect accurately and efficiently to inspect a pattern of a semiconductor device. The pattern inspection apparatus includes: a contour extraction means for extracting contour data of a pattern from a captured image of the semiconductor device; a non-linear part extraction means for extracting a non-linear part from the contour data; an angular part extraction means for extracting an angular part of a pattern from design data of the semiconductor device; and a defect detection section that compares a position of the non-linear part extracted by the non-linear part extraction section with a position of the angular part extracted by the angular part extraction section so as to detect a position of a defective part of a pattern.

Abstract: One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.

Abstract: In a defect judgment operation using tolerance to allow a high-speed operation, the amount of deformation is obtained from an image pickup pattern image, and tolerance including the deformation is generated by deforming a reference pattern image as the basis of the tolerance according to the deformation, and only a disconnection or a contact is judged as an abnormality even if deformation exists in an image pickup pattern.

Abstract: The present invention provides a unified template matching technique which allows an adequate matching position to be provided even in an image with a distorted pattern shape and a variation in edge intensity. A correlation value contribution rate map is created for the vicinity of each of top candidate positions obtained by applying a centroid distance filter to a normalized correlation map resulting from template matching. A corrected intensity image is created from the correlation value contribution rate maps. Luminance correction is performed based on the corrected intensity image. Local matching is performed again on the vicinity of each candidate position. The candidates are then re-sorted based on candidate positions and correlation values newly obtained. Thus, even in an image with a distorted pattern shape and a variation in edge intensity, an adequate matching position can be provided in a unified manner.

Abstract: One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.

Abstract: An inspection apparatus performing template matching of a search image capable of outputting a correct matching position even if a pattern similar to a template exists in the search image is provided.

Abstract: A composite picture forming method and picture forming apparatus forms pattern attribute information contained in an overlapping domain for the overlapping domain between a plurality of pictures to select the pictures to be targeted for a composition in accordance with the pattern attribute information and combine the selected pictures, and the composition of the pictures is also performed in plural stages by using the pattern attribute information in the overlapping domain.

Abstract: A bill recognizing and counting apparatus includes a feeding and transporting mechanism; a line sensor to scan an image of the bills; a denomination determination table in which denomination recognition data is registered for at least one currency; a denomination recognizing unit that recognizes a denomination of the currency by referring to the table; a processing-mode switching unit that switches between a denomination mode and a different currency recognition mode; a different-currency recognizing unit that compares a difference in size between a first bill and each bill of a second bill and thereafter with an allowable range, and recognizes whether the each bill of the second bill and thereafter is of the same denomination as the first bill; and a control unit that guides the bill being determined as a different denomination to a rejecting unit or stops the feeding and transporting mechanism.

Abstract: A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern.

Abstract: A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern.

Abstract: Mutual compatibility is established between the measurement with a high magnification and the measurement in a wide region. A pattern measurement apparatus is proposed which adds identification information to each of fragments that constitute a pattern within an image obtained by the SEM, and which stores the identification information in a predetermined storage format. Here, the identification information is added to each fragment for distinguishing between one fragment and another fragment. According to the above-described configuration, it turns out that the identification information is added to each fragment on the SEM image which has possessed no specific identification information originally. As a result, it becomes possible to implement the SEM-image management based on the identification information.

Abstract: Mutual compatibility is established between the measurement with a high magnification and the measurement in a wide region. A pattern measurement apparatus is proposed which adds identification information to each of fragments that constitute a pattern within an image obtained by the SEM, and which stores the identification information in a predetermined storage format. Here, the identification information is added to each fragment for distinguishing between one fragment and another fragment. According to the above-described configuration, it turns out that the identification information is added to each fragment on the SEM image which has possessed no specific identification information originally. As a result, it becomes possible to implement the SEM-image management based on the identification information.

Abstract: One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.