Patents by Inventor Yasutala Koga

Yasutala Koga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic heater and process for temperature control thereof
    Publication number: 20040035848
    Abstract: By dividing a resistor heating body into 2 or more circuits at outer peripheral side and inner peripheral side and feeding different powers to these circuits based on results of temperatures measured through a temperature measuring means to conduct temperature control, the temperature at the outer peripheral side is made equal to or more than the temperature at the inner peripheral side to uniformize the temperature distribution of the substrate heating face in a radial direction and make small a temperature difference of a heating face for silicon wafer.
    Type: Application
    Filed: August 27, 2003
    Publication date: February 26, 2004
    Applicant: IBIDEN CO., LTD.
    Inventors: Jun Ohashi, Yasutala Koga
  • Ceramic heater and process for temperature control thereof
    Publication number: 20030034341
    Abstract: By dividing a resistor heating body into 2 or more circuits at outer peripheral side and inner peripheral side and feeding different powers to these circuits based on results of temperatures measured through a temperature measuring means to conduct temperature control, the temperature at the outer peripheral side is made equal to or more than the temperature at the inner peripheral side to uniformize the temperature distribution of the substrate heating face in a radial direction and make small a temperature difference of a heating face for silicon wafer.
    Type: Application
    Filed: October 7, 2002
    Publication date: February 20, 2003
    Applicant: IBIDEN CO., LTD.
    Inventors: Jun Ohashi, Yasutala Koga
  • Ceramic heater and method of controlling temperature of the ceramic heater
    Publication number: 20020134775
    Abstract: By dividing a resistor heating body into 2 or more circuits at outer peripheral side and inner peripheral side and feeding different powers to these circuits based on results of temperatures measured through a temperature measuring means to conduct temperature control, the temperature at the outer peripheral side is made equal to or more than the temperature at the inner peripheral side to uniformize the temperature distribution of the substrate heating face in a radial direction and make small a temperature difference of a heating face for silicon wafer.
    Type: Application
    Filed: December 28, 2001
    Publication date: September 26, 2002
    Inventors: Jun Ohashi, Yasutala Koga