Patents by Inventor Yasuto Murata

Yasuto Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087777
    Abstract: A thermistor layer of the present invention is configured to be disposed in an electrical current path. The thermistor layer comprises a thermosensitive particle, a plurality of electro-conductive particles covering a surface of the thermosensitive particle, and a binder adhering the electro-conductive particles, the electro-conductive particles form an electro-conductive network, at least the surface of the thermosensitive particle is made of a thermoplastic resin, the thermoplastic resin softens at a temperature lower than a temperature at which the binder softens, and the thermistor layer is provided to become highly resistive due to softening and deformation of the thermoplastic resin.
    Type: Application
    Filed: February 1, 2021
    Publication date: March 14, 2024
    Inventors: Nobuhiro TSUJI, Manabu MURATA, Hisashi KAWAKAMI, Yasuto IMAI, Yoshiro KOJIMA, Takao FUKUNAGA
  • Publication number: 20230097772
    Abstract: A plate-like alumina particle containing a coloring component is provided. A plate-like alumina particle containing molybdenum, silicon, and a coloring component. A method for manufacturing the plate-like alumina particle, the method including the steps of mixing an aluminum compound containing an aluminum element, a molybdenum compound containing a molybdenum element, silicon or a silicon compound, and a coloring component so as to produce a mixture and calcining the resulting mixture.
    Type: Application
    Filed: October 9, 2019
    Publication date: March 30, 2023
    Inventors: Shaowei Yang, Masamichi HAYASHI, Hironobu OKI, Taro MORIMITSU, Jianjun YUAN, Yasuto MURATA, Cheng LIU, Wei ZHAO
  • Publication number: 20220081310
    Abstract: Provided are a tabular alumina particle and a method for manufacturing it, wherein the particle has a major axis of 30 ?m or more, a thickness of 3 ?m or more, and an aspect ratio of 2 to 50 and contains molybdenum; and the method includes the steps of mixing an aluminum compound of 10% by mass or more in a form of Al2O3, a molybdenum compound of 20% by mass or more in a form of MoO3, a potassium compound of 1% by mass or more in a form of K2O, and silicon or a silicon compound of less than 1% by mass in a form of SiO2, where total amount of raw materials is assumed to be 100% by mass in forms of oxides, so as to produce a mixture and firing the resulting mixture.
    Type: Application
    Filed: January 25, 2019
    Publication date: March 17, 2022
    Applicant: DIC Corporation
    Inventors: Shaowei YANG, Masamichi HAYASHI, Jianjun YUAN, Yasuto MURATA, Cheng LIU, Wei ZHAO
  • Patent number: 4851902
    Abstract: The a system includes a visual inspection unit, a plating thickness inspection unit, and a shape inspection unit, suitably arranged in combination on the inspection line for automatic inspection of stains, flaws, glossiness or deformation in plated IC lead frames. The system can be used by an inventive method to correct errors in positional relation between a reference image and images input from an inspection camera, to obtain a comparison between a reference luminance curve and the individual luminance curves and the correlation between reflectivity and the corresponding area, and to obtain a comparison between the reference correlation and individual correlations to thereby enhance automation and precision in inspection IC lead frames.
    Type: Grant
    Filed: August 5, 1987
    Date of Patent: July 25, 1989
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Junichi Tezuka, Takaaki Kishi, Yasuto Murata
  • Patent number: 4702811
    Abstract: This invention relates to an electro-plating device which is suitable for plating minute portions on protruding tip ends of a connector terminal. This invention device uses a plating solution supplying member in the form of a thin box which is erected upon a plating solution supplying box and which has a thickness small enough to be inserted between opposing plating areas. The plating areas are a pair of protruding tip ends of the connector terminal which move in contact with or near the supplying member. The plating solution supplying member comprises a combination of a supporting member made of an insulating sheet having a vertical section substantially shaped like an inverted letter U and a plating solution retaining member of a net or porous sheet which is supported by the supporting member to drape over the outer surfaces thereof.
    Type: Grant
    Filed: October 29, 1986
    Date of Patent: October 27, 1987
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Yasuto Murata, Junichi Tezuka, Kenji Yamamoto
  • Patent number: 4683045
    Abstract: This is a plating device for partially electroplating connector terminals at the tip, the target portions to be plated being a pair of forked portions of each connector terminal that are opposing to each other. In this partial plating device, a plating solution supply member to be inserted between the pair of target portions in the connector terminals comprises a support member, anode, net member and winding means. The support member has a top portion substantially forming an arrowhead with slanted guide planes on both sides. An opening is provided at or near the tip of this top portion to allow seepage of the plating solution. The net member covers the top portion of the support at its tip as well as the surface in its vicinity, the net member being freely wound up in the direction intersecting the passage line by the winding means and forming a supply section for the plating solution at a location corresponding to said passage line.
    Type: Grant
    Filed: October 29, 1986
    Date of Patent: July 28, 1987
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Yasuto Murata, Junichi Tezuka, Kenji Yamamoto
  • Patent number: 4655881
    Abstract: Fork-like connector terminals are moved along the pass line under guidance so that the forked end part thereof won't pass astray from the predetermined passageway. A plating brush, which has been positioned in alignment with the predetermined passageway of the end part of said fork-like connector terminal, is moved into the gap between the opposing portions to be plated at the end of each terminal or passed through said gap in such a way that said brush contacts only the small-area portions to be plated and applies thereto the plating solution supplied to said brush by the liquid retaining material to thereby perform desired plating.
    Type: Grant
    Filed: April 16, 1986
    Date of Patent: April 7, 1987
    Assignee: Electroplating Engineers of Japan, Limited
    Inventors: Junichi Tezuka, Yasuto Murata