Abstract: An ACF attachment method includes supplying an electronic component from a component supply unit, suctioning the electronic component, simultaneously attaching a first ACF to a first terminal surface of the electronic component and a second ACF to a second terminal surface of the electronic component, and providing an ACF attachment device which includes two ACF attachment units for attaching the first ACF and the second ACF. The first terminal surface is disposed on a first edge portion of the electronic component and the second terminal surface is disposed on a second edge portion of the electronic component. The two ACF units are positioned according to a space between the first terminal surface and the second terminal surface of the electronic component, and attaching the first and second ACFs is performed using the two ACF attachment units.

Abstract: A component mounting apparatus includes: a plurality of pressure-bonding units which are arrayed in line and each of which includes a pressure-bonding head for pressure-bonding a component to a component pressure-bonding area of the substrate, and an edge-portion support member for supporting an edge portion of the substrate during the pressure bonding; a guide support member for supporting the pressure-bonding units so that their movement along the edge portion for execution of substrate pressure-bonding can be guided; a common head up/down unit for integrally moving up and down the individual pressure-bonding heads; and a plurality of unit-moving devices which are provided for the plurality of pressure-bonding units, individually and respectively, to move the pressure-bonding units along the edge portion so that placement of the pressure-bonding units is changed.

Abstract: A component mounting apparatus includes: a plurality of pressure-bonding units which are arrayed in line and each of which includes a pressure-bonding head for pressure-bonding a component to a component pressure-bonding area of the substrate, and an edge-portion support member for supporting an edge portion of the substrate during the pressure bonding; a guide support member for supporting the pressure-bonding units so that their movement along the edge portion for execution of substrate pressure-bonding can be guided; a common head up/down unit for integrally moving up and down the individual pressure-bonding heads; and a plurality of unit-moving devices which are provided for the plurality of pressure-bonding units, individually and respectively, to move the pressure-bonding units along the edge portion so that placement of the pressure-bonding units is changed.

Abstract: There is provided an ACF attachment device that attaches ACFs to an electronic component for saving installation space, improving mounting tact time, and reducing costs in a liquid crystal driver mounting stage. A preliminary press bonding device (102) includes a component supply unit (401), an ACF attachment device (101), and a preliminary press bonding unit (305). The ACF attachment device (101) includes an ACF attachment unit (301) that simultaneously attaches the ACFs to two sides on a panel side and a PCB side of the electronic component, an ACF tape supply unit (302) that supplies an ACF tape, a nozzle (303) that suctions and holds the electronic component, and a separator collection unit (304) that collects separators bonded to the ACFs.

Abstract: A plurality of flexible printed circuit boards are held on a transfer carrier, which is formed by a base plate and a resin layer formed on an upper surface of the base plate. Reference pins are positioned at reference pin openings of the carrier base plate and reference holes of the flexible printed circuit boards are positioned at the reference pins in order to adhere the board to the carrier resin layer. Electronic parts are mounted on the flexible printed circuit board by bonding the electronic parts to bonding portions of the flexible printed circuit board.

Abstract: In a bonding method in which two display panels 7A, 7B are held by the two panel holding portions 31a, 31b provided on the panel support table 31 positioned by the XY? table 30 so as to position the first pressure bonding head 25A and the second pressure bonding head 25B for conducting pressure bonding individually, according to the result of positional detection of the camera 37 and the recognizing portion 65, the display panel 7A is positioned to the first pressure bonding head and an object of pressure bonding is bonded by pressure. In this pressure bonding step, under the condition that a state of holding the display panel 7A is released, the display panel 7B is positioned to the second pressure bonding head 25B.

Abstract: In a bonding method in which two display panels 7A, 7B are held by the two panel holding portions 31a, 31b provided on the panel support table 31 positioned by the XY&thgr; table 30 so as to position the first pressure bonding head 25A and the second pressure bonding head 25B for conducting pressure bonding individually, according to the result of positional detection of the camera 37 and the recognizing portion 65, the display panel 7A is positioned to the first pressure bonding head and an object of pressure bonding is bonded by pressure. In this pressure bonding step, under the condition that a state of holding the display panel 7A is released, the display panel 7B is positioned to the second pressure bonding head 25B.

Abstract: To provide a transfer carrier for a flexible printed circuit board and an electronic parts mounting method on a flexible printed circuit board which can cope with different mounting methods by using the same transfer carrier.

Abstract: An assembly method for electronic appliances includes applying adhesive to a PCB; supplying an electronic component to the PCB; holding the electronic component with a mounting device and then placing the electronic component onto the PCB; pressing the electronic component onto the PCB; and detecting the electronic component held by the mounting device. The assembly method utilizes two or more bonders. This enables mounting and bonding of required components for assembling an electronic appliance using a single apparatus. In particular, the assembly method is effective for assembling display devices.

Abstract: An assembly apparatus for electronic appliances of the present invention includes an adhesive applicator for applying adhesive to a PCB; a mounting section for placing an electronic component on the PCB; two or more bonders for pressing the electronic component onto the PCB; a feeder for supplying the electronic component to the PCB; a mounting means for placing the electronic component on the PCB; and a recognizer for detecting the electronic component held by the mounting means. The assembly apparatus of the present invention has two or more bonders in a single equipment. This enables the mounting and bonding of the required components for assembling an electronic appliance using a single apparatus, allowing reduction of equipment costs for assembling electronic appliances. In particular, the assembly apparatus for electronic appliances of the present invention is effective for assembling display devices.

Abstract: A bonding machine bonds electronic components to a substrate and makes it possible to prevent the breakage of wires from occurring without use of slip rings. A first terminal is connected to a thermal pressing head through a wire and is installed on a rotating member. A second terminal is connected to an electric power supply through a wire and is installed below the rotating member. The first terminal and second terminal contact only when electric current is supplied to the thermal pressing head. Both contacts are separated when the thermal pressing head releases the electronic component and is moved away from the substrate.

Abstract: To present means for bonding two types of devices on a display panel at high speed and at high precision.A first feed section comprising first devices and a second feed section comprising second devices are provided. Among the display panel, first feed section, and second feed section, a turntable comprising a first nozzle for picking up first devices and a second nozzle for picking up second devices is provided.Between the turntable and display panel, a first head for bonding the first device sucked in vacuum to the first nozzle to a longer side of the display panel, and a second head for bonding the second device sucked in vacuum to the second nozzle to a shorter side of the display panel are provided.

Abstract: An apparatus for bonding electronic components on a substrate with high precision and at high speed includes a table device for positioning the substrate to a bonding position, a transfer head that receives the electronic component, a rotating body with a plurality of transfer heads that rotates the transfer head to the bonding position, a recognition device that senses a deviation in position between the substrate and the electronic component which has been transferred by the transfer head to the bonding position and a driving mechanism which, according to the deviation in position sensed by the recognition device, finely displaces a lever installed on the transfer head in order to finely rotate the electronic component.

Abstract: An outer-lead bonding apparatus according to the present invention comprises:(1) a punching die to stamp out chips from a film carrier tape,(2) a mounter to mount TAB chips on a substrate,(3) a first cover to enclose the mounter,(4) a second cover to enclose the punching die,(5) a pressure regulator to supply higher air pressure than outer air into inside space of the first cover, and(6) a exhaust to exhaust air from inside space of the second covering means. The outer-lead bonding apparatus of this invention keeps the environment around the mounter clean with air supplied from a pressure regulator and also by exhausting the air polluted by the punching operation through the exhaust. Neither products nor outer environment is thus contaminated.

Abstract: In an apparatus for mounting electronic components, punched out from film carriers to a substrate, there is disclosed an upper die for punching the electronic components through a hole formed in a lower die. A take out nozzle is located under the through hole for sucking the punched out electronic component from the hole in the lower die. A transfer nozzle is provided for receiving the electronic component from the take out nozzle and for transmitting the electronic component to a substrate mounted on a movable table. Before any leadwires of the component are bonded to the electrodes of the substrate, the table is finely positioned to property align the leadwires and the electrodes.

Abstract: An outer lead bonding apparatus and method bonds an outer lead of a tape carrier package to an electrode formed on a display panel. During the observation stage when positional deviations between the outer lead and electrode are detected and corrected, a pressing member presses on the outer lead to remove any warp or bend in the outer lead. The electrode includes anisotropic conductive tape which is inherently adhesive. To prevent unwanted movement of the tape carrier package during the observation and positioning process by premature sticking of the outer lead to the tape on the electrode, the tape carrier package is sandwiched firmly in place.