Abstract: Provided is a method of producing a friction material that can prevent occurrence of dust generation and segregation at the time of mixing raw materials of the friction material and that is resistant to deterioration of the friction material even when a phenol resin is employed as a binder and that also allows the production process to be effected safely and speedily and at a low cost. The method includes a mixing step (A) for stirring the raw materials for the friction material containing a high-ortho phenol resin, slaked lime and 3-10 wt. % of water and a forming step (B) for forming a mixture powder obtained from the mixing step (A) to a desired shape at room temperature.

Abstract: Provided is a method of producing a friction material that can prevent occurrence of dust generation and segregation at the time of mixing raw materials of the friction material and that is resistant to deterioration of the friction material even when a phenol resin is employed as a binder and that also allows the production process to be effected safely and speedily and at a low cost. The method includes a mixing step (A) for stirring the raw materials for the friction material containing a high-ortho phenol resin, slaked lime and 3-10 wt. % of water and a forming step (B) for forming a mixture powder obtained from the mixing step (A) to a desired shape at room temperature.

Abstract: A substrate inspection apparatus includes a recipe preparation unit that batch-allocates a plurality of slots containing substrates of each type with a corresponding one of a plurality of original recipes to the each type, the plurality of original recipes corresponding to different types of substrates respectively, so as to prepare an actual recipe based on the plurality of original recipes, and to inspect the different types of substrates according to the actual recipe.

Abstract: A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: A substrate inspection apparatus includes a recipe preparation unit that batch-allocates a plurality of slots containing substrates of each type with a corresponding one of a plurality of original recipes to the each type, the plurality of original recipes corresponding to different types of substrates respectively, so as to prepare an actual recipe based on the plurality of original recipes, and to inspect the different types of substrates according to the actual recipe.

Abstract: A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: A semiconductor wafer inspection apparatus of the present invention is provided with the following a rotatable table on which a semiconductor wafer is sucked and held, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.