Patents by Inventor Yasutoshi Nakazawa

Yasutoshi Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for producing the same
    Patent number: 6703695
    Abstract: The semiconductor device is composed of a semiconductor die 1, and a lead frame 7 equipped with a die paddle 2 for mounting the semiconductor die and lead terminals 3, 4, 5, 6 for external connections, with the die paddle 2 and die paddle-side ends of the lead terminals 3, 4, 5, 6 being encapsulated together in a plastic package. The die paddle 2 is provided with links 14, 15, 16 which extend one by one between the lead terminals 3, 4, 5, 6. The extreme end of each link 14, 15, 16 is joined with adjacent lead terminals. The semiconductor die 1 is electrically connected with some of the lead terminals which correspond to a wiring pattern of an external circuit. Any of the links 14, 15, 16 uninvolved in the electrical connections is cut off.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: March 9, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Yasutoshi Nakazawa
  • Semiconductor device and method for producing the same
    Publication number: 20030178712
    Abstract: The semiconductor device is composed of a semiconductor die 1, and a lead frame 7 equipped with a die paddle 2 for mounting the semiconductor die and lead terminals 3, 4, 5, 6 for external connections, with the die paddle 2 and die paddle-side ends of the lead terminals 3, 4, 5, 6 being encapsulated together in a plastic package. The die paddle 2 is provided with links 14, 15, 16 which extend one by one between the lead terminals 3, 4, 5, 6. The extreme end of each link 14, 15, 16 is joined with adjacent lead terminals. The semiconductor die 1 is electrically connected with some of the lead terminals which correspond to a wiring pattern of an external circuit. Any of the links 14, 15, 16 uninvolved in the electrical connections is cut off.
    Type: Application
    Filed: March 19, 2003
    Publication date: September 25, 2003
    Inventor: Yasutoshi Nakazawa