Abstract: The second present invention provides a method of dividing a semiconductor wafer with an orientation flat into a plurality of pellets defined by both first scribe regions which extend in parallel to each other over the semiconductor wafer in a first direction parallel to the orientation flat and second scribe regions which extend in parallel to each other over the semiconductor wafer in a second direction perpendicular to the first direction. The method comprises the following steps. A metal film is selectively provided, which covers at least the first and second scribe regions. The metal film is selectively etched along longitudinal center lines of the first and second scribe regions by a lithography using a resist, so as to form metal masks, each of which comprises a pair of slender stripe masks separated from each other by a gap which extends on the longitudinal center line, so that longitudinal center parts of the first and second scribe regions are shown through the gaps of the metal masks.