Patents by Inventor Yasuyo Kawabata

Yasuyo Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Exposure apparatus, structure, method for setting up apparatus, and device manufacturing method having filling member formed by hardening liquid to support setting leg
    Patent number: 8780329
    Abstract: An exposure apparatus of the present invention is configured to expose a pattern on an original onto a wafer via a projection lens system 110. The exposure apparatus includes a setting leg 105, platens 103, 107, and 109 on which at least one of a reticle stage apparatus 108 configured to hold the original, the projection optical system 110, a wafer stage apparatus 102 configured to hold the wafer, and an interferometer configured to measure a position of the original stage or the wafer stage is mounted, a vibration isolation support mechanism 105 which is provided between the platens 103, 107, and 109 and the setting leg 105 and configured to reduce a vibration, and a filling member 122 formed by hardening a hardening type liquid 113 which is filled between the setting leg 105 and a setting floor 101.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: July 15, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiromichi Hara, Yasuyo Kawabata
  • EXPOSURE APPARATUS, STRUCTURE, METHOD FOR SETTING UP APPARATUS, AND DEVICE MANUFACTURING METHOD
    Publication number: 20090168036
    Abstract: An exposure apparatus of the present invention is configured to expose a pattern on an original onto a wafer via a projection lens system 110. The exposure apparatus includes a setting leg 105, platens 103, 107, and 109 on which at least one of a reticle stage apparatus 108 configured to hold the original, the projection optical system 110, a wafer stage apparatus 102 configured to hold the wafer, and an interferometer configured to measure a position of the original stage or the wafer stage is mounted, a vibration isolation support mechanism 105 which is provided between the platens 103, 107, and 109 and the setting leg 105 and configured to reduce a vibration, and a filling member 122 formed by hardening a hardening type liquid 113 which is filled between the setting leg 105 and a setting floor 101.
    Type: Application
    Filed: December 22, 2008
    Publication date: July 2, 2009
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Hiromichi Hara, Yasuyo Kawabata