Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: A stage apparatus has a substrate holding unit which chucks and holds a substrate, and includes a flat surface having a recess where the substrate holding unit is to be mounted. A fixing member fixes a projection support provided to the substrate holding unit onto the flat surface. The substrate holding unit is supported by the fixing member while a distal end of the projection support is in contact with the recess of the flat surface and the remaining portion of the substrate holding unit is not in contact with the flat surface.

Abstract: A stage apparatus has a substrate holding unit which chucks and holds a substrate, and includes a flat surface having a recess where the substrate holding unit is to be mounted. A fixing member fixes a projection support provided to the substrate holding unit onto the flat surface. The substrate holding unit is supported by the fixing member while a distal end of the projection support is in contact with the recess of the flat surface and the remaining portion of the substrate holding unit is not in contact with the flat surface.

Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: A stage apparatus is a stage apparatus having a substrate holding unit which chucks and holds a substrate, and includes a flat surface having a recess where the substrate holding unit is to be mounted, and a fixing member which fixes a projection support provided to the substrate holding unit onto the flat surface. The substrate holding unit is supported by the fixing member while a distal end of the projection support is in contact with the recess of the flat surface and the remaining portion of the substrate holding unit is not in contact with the flat surface.