Abstract: A component supplying device supplying a component while using a component supply tape having components thereon includes a reel support portion rotatably supporting a reel around which the component supply tape is wound, a feeder transferring the component supply tape drawn out from the reel toward a component pick-up position and transferring the component supply tape from which the component is picked up at the component pick-up position S1 toward a tape discharge path, and a correction member arranged on a transfer path of the component supply tape between the reel support portion and the tape discharge path. The correction member is configured to correct curl of the component supply tape.

Abstract: A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.

Abstract: A component transfer apparatus includes: an upthrust section that thrusts up a wafer component held by a wafer holding table from below; an extraction head that suctions the wafer component thrust up by the upthrust section or an adjustment chip placed on the upthrust section; an imaging section that performs imaging of the wafer component or the adjustment chip being suctioned by the extraction head; and a control section that controls driving of the extraction head and operations of the imaging section. Upon suction position adjustment, the control section causes the imaging section to perform imaging of the wafer component or the adjustment chip being suctioned by the extraction head, and adjusts a suction position of the wafer component by the extraction head based on a result of the imaging.

Abstract: A component supplying device supplying a component while using a component supply tape having components thereon includes a reel support portion rotatably supporting a reel around which the component supply tape is wound, a feeder transferring the component supply tape drawn out from the reel toward a component pick-up position and transferring the component supply tape from which the component is picked up at the component pick-up position S1 toward a tape discharge path, and a correction member arranged on a transfer path of the component supply tape between the reel support portion and the tape discharge path. The correction member is configured to correct curl of the component supply tape.

Abstract: A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.

Abstract: A component transfer apparatus includes: an upthrust section that thrusts up a wafer component held by a wafer holding table from below; an extraction head that suctions the wafer component thrust up by the upthrust section or an adjustment chip placed on the upthrust section; an imaging section that performs imaging of the wafer component or the adjustment chip being suctioned by the extraction head; and a control section that controls driving of the extraction head and operations of the imaging section. Upon suction position adjustment, the control section causes the imaging section to perform imaging of the wafer component or the adjustment chip being suctioned by the extraction head, and adjusts a suction position of the wafer component by the extraction head based on a result of the imaging.

Abstract: [Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head. [Means for Solving the Problems] A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5).

Abstract: [Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head. [Means for Solving the Problems] A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5).