Patents by Inventor Yasuyoshi Kitazawa

Yasuyoshi Kitazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9159600
    Abstract: The wafer transport apparatus prevents contaminant deposited on an unprocessed wafer from adhering to a processed wafer. Carrying-in load port 2A is loaded with a FOUP 1 storing an unprocessed wafer W1. Carrying-in chamber 3A has a transport robot 4A which takes out the unprocessed wafer W1 from the FOUP 1. Carrying-in load lock 5A is accessed by the transport robot 4A from the carrying-in chamber 3A side. Carrying-out load port 2B is loaded with the FOUP 1 that can store a processed wafer W2. Carrying-out chamber 3B has a transport robot 4B which passes the processed wafer W2 to the FOUP 1. Carrying-out load lock 5B is accessed by the transport robot 4B from the carrying-out chamber 3B side. The carrying-in chamber 3A and carrying-out chamber 3B are separated from each other. The carrying-in load lock 5A and carrying-out load lock 5B are arranged on different stages.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: October 13, 2015
    Assignee: SINFONIA TECHNOLOGY CO., LTD.
    Inventors: Takumi Mizokawa, Yasuyoshi Kitazawa
  • Patent number: 8522958
    Abstract: An object is to provide a vacuum processing apparatus that is capable of suppressing the costs and making control easy. Provided is a vacuum processing apparatus that includes a vacuum section (2) of which inside is held in vacuum, a placing section (3) that is disposed inside the vacuum section (2) and is capable of placing a workpiece thereon, a linear motor 4) that includes coils (415) and makes the placing section (3) travel within the vacuum section, wherein air is placed inside the placing section (3) while being isolated from the vacuum section (2), and the coils (415) of the linear motor (4) are disposed inside the placing section (3).
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: September 3, 2013
    Assignees: Tokyo Electron Limited, Sinfonia Technology Co., Ltd.
    Inventors: Yasuhiro Tobe, Satoru Kawakami, Shinji Matsubayashi, Yosuke Muraguchi, Yasuyoshi Kitazawa, Yasumichi Mieno
  • Publication number: 20110076119
    Abstract: An object is to provide a vacuum processing apparatus that is capable of suppressing the costs and making control easy. Provided is a vacuum processing apparatus that includes a vacuum section (2) of which inside is held in vacuum, a placing section (3) that is disposed inside the vacuum section (2) and is capable of placing a workpiece thereon, a linear motor 4) that includes coils (415) and makes the placing section (3) travel within the vacuum section, wherein air is placed inside the placing section (3) while being isolated from the vacuum section (2), and the coils (415) of the linear motor (4) are disposed inside the placing section (3).
    Type: Application
    Filed: May 19, 2009
    Publication date: March 31, 2011
    Inventors: Yasuhiro Tobe, Satoru Kawakami, Shinji Matsubayashi, Yosuke Muraguchi, Yasuyoshi Kitazawa, Yasumichi Mieno
  • Patent number: 6914233
    Abstract: The wafer mapping system has an access port for transferring a wafer in and out and detects an accommodated wafer for a cassette in which slots for accommodating and holding inserted wafers are disposed in tiers. The wafer mapping system includes (1) a receiver that is fixed to a member facing the access port for receiving elements arranged serially along a height direction of the cassette, and (2) a transmitter that is disposed movable in an up and down direction of the cassette and transmits a signal toward a wafer accommodated in each of the slots of the cassette. The receiver receives a signal from the transmitter, and thereby the presence or absence of a wafer and a state of a wafer accommodated in each of the slots of the cassette are detected. Thereby, with a simple system configuration, an accommodation state of the wafer can be accurately detected.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: July 5, 2005
    Assignee: Shinko Electric Co., Ltd.
    Inventors: Yasuyoshi Kitazawa, Shigeto Suzuki, Toshio Miki, Susumu Nakagawa, Katsumi Yasuda, Kazunari Kitaji
  • Publication number: 20030119214
    Abstract: A wafer mapping system according to the present invention is provided with an access port for transferring in and out a wafer, and performs a detection operation of an accommodated wafer to a cassette in which slots for accommodating and holding substantially level a plurality of inserted wafers are disposed in a plurality of tiers. The wafer mapping system comprises: a receiver that is fixed to a member facing the access port and formed of receiving elements arranged serially along a height direction of the cassette; and a transmitter that is disposed movable in a up and down direction of the cassette and transmits a signal toward a wafer accommodated in each of the slots of the cassette; wherein the receiver receives a signal transmitted from the transmitter, and thereby presence or absence and a state of a wafer accommodated in each of the slots of the cassette are detected. Thereby, with a simple system configuration, an accommodation state of the wafer in a FOUP can be accurately detected.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 26, 2003
    Applicant: SHINKO ELECTRIC CO., LTD.
    Inventors: Yasuyoshi Kitazawa, Shigeto Suzuki, Toshio Miki, Susumu Nakagawa, Katsumi Yasuda, Kazunari Kitaji