Patents by Inventor Yasuyoshi Kuroka

Yasuyoshi Kuroka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat
    Patent number: 6332828
    Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
    Type: Grant
    Filed: July 11, 2000
    Date of Patent: December 25, 2001
    Assignees: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp.
    Inventors: Fumihiko Hasegawa, Yasuyoshi Kuroka, Toshihiro Tsuchiya, Koichiro Ichikawa, Yasuo Inada
  • Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat
    Patent number: 6113463
    Abstract: A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: September 5, 2000
    Assignees: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp.
    Inventors: Fumihiko Hasegawa, Yasuyoshi Kuroka, Toshihiro Tsuchiya, Koichiro Ichikawa, Yasuo Inada