Patents by Inventor Yasuyoshi Sakamoto

Yasuyoshi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240106524
    Abstract: A transmission data controller determines a frequency bandwidth according to a relay apparatus position, the frequency bandwidth being used for a first signal transmitted from a first communication apparatus, on the basis of information regarding the number of first communication apparatuses with which a relay apparatus communicates at the relay apparatus position. The transmission data controller transmits band information indicating a frequency band selected from radio frequency bands that can be used for the first signal on the basis of the determined frequency bandwidth to the first communication apparatus. The first communication apparatus transmits the first signal having a frequency included in the frequency band indicated by the band information. The relay apparatus acquires waveform data of the first signal transmitted by the first communication apparatus, and transmits the acquired waveform data to a second communication apparatus by a second signal.
    Type: Application
    Filed: December 24, 2020
    Publication date: March 28, 2024
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Kazumitsu SAKAMOTO, Yosuke FUJINO, Daisuke GOTO, Yasuyoshi KOJIMA, Kiyohiko ITOKAWA
  • Patent number: 7270535
    Abstract: An object is to provide a disc-molding mold which can increase the degree of transfer of a pattern of a stamper to thereby improve quality of molded products, as well as a molded product and a molding machine. In the vicinity of the outer peripheral edges of first and second disc-shaped members, the cooling capacity of the medium flow passage of the stamper-side disc-shaped member is made lower than the cooling capacity of the medium flow passage of the non-stamper-side disc-shaped member. On the stamper side, the quantity of heat radiated from the outer peripheral edge of the stamper-side disc-shaped member to the outside of the disc-molding mold can be reduced, whereby over-cooling of the stamper-side disc-shaped member can be prevented.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: September 18, 2007
    Assignees: Sumitomo Heavy Industries, Ltd., Seikoh Giken Co., Ltd.
    Inventors: Yuichi Inada, Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Publication number: 20060051552
    Abstract: An object of the present invention is to provide a mold for molding, a molding method, and a molding machine in which generation of burrs on a disc substrate can be prevented to thereby enhance quality of the disc substrate, as well as a disc substrate molded by the same. The mold for molding includes a mirror-surface disc (16); a stamper (29) having a hole formed at its center, and attached to the front end surface of the mirror-surface disc (16); and an inner holder (60) for holding the stamper (29) by means of press fit into the hole. In the course of the press fit, at least either the stamper (29) or the inner holder (60) is subjected to stress in excess of its yield point and plastically deformed. In this case, the inner holder (60) is press-fitted into the hole of the stamper (29) to thereby hold the stamper (29), thereby eliminating need to form a holding portion at the outer circumferential edge of the front end of the inner holder (60).
    Type: Application
    Filed: November 17, 2003
    Publication date: March 9, 2006
    Applicants: Sumitomo Heavy Industries, Ltd., Seikoh Giken Co., Ltd.
    Inventors: Yuichi Inada, Yasuyoshi Sakamoto
  • Publication number: 20050220925
    Abstract: An object is to provide a disc-molding mold which can increase the degree of transfer of a pattern of a stamper to thereby improve quality of molded products, as well as a molded product and a molding machine. In the vicinity of the outer peripheral edges of first and second disc-shaped members, the cooling capacity of the medium flow passage of the stamper-side disc-shaped member is made lower than the cooling capacity of the medium flow passage of the non-stamper-side disc-shaped member. On the stamper side, the quantity of heat radiated from the outer peripheral edge of the stamper-side disc-shaped member to the outside of the disc-molding mold can be reduced, whereby over-cooling of the stamper-side disc-shaped member can be prevented.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Yuichi Inada, Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Publication number: 20050220928
    Abstract: An object is to provide a mold apparatus which can prevent inclination of a machining member to thereby improve quality of molded products. The mold apparatus includes a first mold unit; a second mold unit; a sprue bush (24) disposed in one of the first and second mold units and having a sprue (26) for charging a molding material into a cavity space (C); a machining member disposed in the other of the first and second mold units in such a manner that the machining member can be advanced and retracted, the machining member performing a predetermined machining for a prototype of a molded product when the machining member is advanced; and a bush (47) disposed radially outward of the machining member to surround the machining member and having a flow passage (55) which is formed in a front end portion thereof and through which a temperature control medium flows.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 6, 2005
    Inventors: Yuichi Inada, Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Patent number: 6558152
    Abstract: A disc-molding mold includes a first support plate disposed at the stationary side of the mold; a first mirror-surface disc attached to the first support plate; a first guide ring disposed radially outside the first mirror-surface disc and attached to the first support plate; a second support plate disposed at the movable side of the mold; a second mirror-surface disc attached to the second support plate; a second guide ring disposed radially outside the second mirror-surface disc and attached to the second support plate; a guide post attached to either the first or second guide ring and projecting toward the other guide ring; and a guide bushing attached to the other guide ring and adapted to guide the guide post. The first and second guide rings each have a temperature control medium passage formed therein in order to allow passage of a temperature control medium. Thus, the thermal expansion of the first guide ring is made equal to that of the second guide ring.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: May 6, 2003
    Assignees: Seikoh Giken Co., Ltd., Sumitomo Heavy Industries, Ltd.
    Inventors: Katsuyuki Yasuda, Yasuyoshi Sakamoto, Hiroyuki Sawaishi
  • Publication number: 20020018827
    Abstract: A disc-molding mold includes a first support plate disposed at the stationary side of the mold; a first mirror-surface disc attached to the first support plate; a first guide ring disposed radially outside the first mirror-surface disc and attached to the first support plate; a second support plate disposed at the movable side of the mold; a second mirror-surface disc attached to the second support plate; a second guide ring disposed radially outside the second mirror-surface disc and attached to the second support plate; a guide post attached to either the first or second guide ring and projecting toward the other guide ring; and a guide bush attached to the other guide ring and adapted to guide the guide post. The first and second guide rings each have a temperature control medium passage formed therein in order to allow passage of a temperature control medium. Thus, the thermal expansion of the first guide ring is made equal to that of the second guide ring.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 14, 2002
    Inventors: Katsuyuki Yasuda, Yasuyoshi Sakamoto, Hiroyuki Sawaishi
  • Patent number: 5773040
    Abstract: In a disc molding die, a stationary base plate is attached to a stationary platen, and a stationary mirror-surface plate is attached to the stationary base plate. Further, a movable base plate is attached to a movable platen, and a movable mirror-surface plate is attached to the movable base plate. A stationary guide ring is attached to the stationary base plate so as to surround the stationary mirror-surface plate, while a movable guide ring is attached to the movable base plate so as to surround the movable mirror-surface plate. When the die is clamped, the movable guide ring is brought into contact with the stationary guide ring. A cavity ring is detachably attached to one of the stationary and movable mirror-surface plates such that the cavity ring projects toward the other of the stationary and movable mirror-surface plates.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: June 30, 1998
    Assignees: Seikoh Giken Co., Ltd., Sumitomo Heavy Industries, Ltd.
    Inventors: Yasuyoshi Sakamoto, Akira Hatano
  • Patent number: 5693348
    Abstract: A disc molding die includes a stationary-side mirror block disposed on a stationary die, a movable-side mirror block disposed on a movable die and facing the stationary-side mirror block so as to define a cavity in combination with the stationary-side mirror block, and a cavity ring disposed on the radially outer side of one of the stationary-side mirror block and the movable-side mirror block so as to define the outer circumferential edge of each disc substrate. The portion of the cavity ring facing the cavity is roughened. When resin is charged into a cavity, very small spaces are formed between the resin and the inner circumferential surface of the cavity ring, due to the roughened portion of the cavity ring facing the cavity. Therefore, the release resistance during die opening or releasing can be decreased.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: December 2, 1997
    Assignees: Seikoh Giken Co., Ltd., Sumitomo Heavy Industries, Ltd.
    Inventors: Yasuyoshi Sakamoto, Takehiko Kitamura, Akira Hatano
  • Patent number: 5388982
    Abstract: An injection molding die for simultaneously molding a plurality of optical disc base boards. The die has a stationary die assembly portion that includes a first base plate having a first center axis, and a plurality of first cavities each having a respective center axis. The first cavities are arranged in an equally spaced relationship along a circumference of a circle coaxial with the first center axis. The die also has a movable die assembly portion that includes a second base plate having a second center axis, and a plurality of second cavities each having a respective center axis. Each second cavity positionally corresponds to a respective first cavity. The first center axis is aligned with the second center axis using a guide rod fixedly secured to the first base plate and that extends along the first center axis, and by using a guide member that extends along the second center axis to be positionally coincident with the first center axis.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: February 14, 1995
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Mitsuo Takahashi, Katsuyuki Yasuda, Yasuyoshi Sakamoto
  • Patent number: D520034
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: May 2, 2006
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Patent number: D521032
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: May 16, 2006
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Patent number: D521033
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: May 16, 2006
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Patent number: D526667
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: August 15, 2006
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Yasuyoshi Sakamoto, Katsuyuki Hiki
  • Patent number: D528572
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: September 19, 2006
    Assignee: Seikoh Giken Co., Ltd.
    Inventors: Yasuyoshi Sakamoto, Katsuyuki Hiki