Patents by Inventor Yasuyuki Agari
Yasuyuki Agari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11046787Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: GrantFiled: May 9, 2018Date of Patent: June 29, 2021Assignees: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Publication number: 20210187902Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.Type: ApplicationFiled: February 28, 2017Publication date: June 24, 2021Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Patent number: 10752755Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: GrantFiled: February 28, 2017Date of Patent: August 25, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Takayuki Hattori, Jyunichi Inagaki, Takafumi Kuninobu, Kazuhiro Takizawa, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Patent number: 10679922Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: GrantFiled: February 28, 2017Date of Patent: June 9, 2020Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota, Akinori Okada
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Publication number: 20200123275Abstract: Provided are a polylactide-grafted cellulose nanofiber that is suitable as a molding material, and a production method thereof. A polylactide-grafted cellulose nanofiber includes grafted cellulose having a graft chain bonding to cellulose constituting a cellulose nanofiber, wherein the graft chain is a polylactide, and a ratio of an absorbance derived from C?O of the polylactide to an absorbance derived from O—H of the cellulose on an infrared absorption spectrum is no less than 0.01 and no greater than 1,000. In addition, a production method of a polylactide-grafted cellulose nanofiber includes carrying out graft polymerization of a lactide to cellulose constituting a cellulose nanofiber in the presence of an organic polymerization catalyst which includes an amine and a salt obtained by reacting the amine with an acid. As the organic polymerization catalyst, 4-dimethylaminopyridine and 4-dimethylaminopyridinium triflate are preferred.Type: ApplicationFiled: May 9, 2018Publication date: April 23, 2020Applicants: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, DAIO PAPER CORPORATIONInventors: Joji Kadota, Yasuyuki Agari, Hiroshi Hirano, Akinori Okada, Takaaki Imai
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Publication number: 20190055444Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: February 21, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Patent number: 10202530Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.Type: GrantFiled: August 26, 2015Date of Patent: February 12, 2019Assignees: JNC CORPORATION, Osaka Research Institute of Industrial Science and TechnologyInventors: Takeshi Fujiwara, Jyunichi Inagaki, Masako Hinatsu, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Publication number: 20190023900Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, Jyunichi INAGAKI, Masako HINATSU, Yasuyuki AGARI, Hiroshi HIRANO, Joji KADOTA, Akinori OKADA
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Publication number: 20190023847Abstract: This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent and the other end of the second coupling agent are each bonded to a bifunctional or higher silsesquioxane by a curing treatment, as illustrated in FIG. 2; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent and the other end of the second coupling agent are bonded together as illustrated in FIG. 3.Type: ApplicationFiled: February 28, 2017Publication date: January 24, 2019Applicants: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi FUJIWARA, TAKAYUKI HATTORI, JYUNICHI INAGAKI, TAKAFUMI KUNINOBU, Kazuhiro TAKIZAWA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA, AKINORI OKADA
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Patent number: 9938371Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.Type: GrantFiled: May 8, 2015Date of Patent: April 10, 2018Assignees: JNC CORPORATION, OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Takeshi Fujiwara, Jyunichi Inagaki, Yukito Yada, Akinori Okada, Yasuyuki Agari, Hiroshi Hirano, Joji Kadota
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Publication number: 20170306207Abstract: The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.Type: ApplicationFiled: August 26, 2015Publication date: October 26, 2017Applicants: JNC CORPORATION, OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTEInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, MASAKO HINATSU, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
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Publication number: 20170137561Abstract: A composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.Type: ApplicationFiled: May 8, 2015Publication date: May 18, 2017Applicants: JNC CORPORATION, Osaka Municipal Technical Research InstituteInventors: TAKESHI FUJIWARA, JYUNICHI INAGAKI, YUKITO YADA, AKINORI OKADA, YASUYUKI AGARI, HIROSHI HIRANO, JOJI KADOTA
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Patent number: 8822583Abstract: The present invention provides a transparent heat radiating coating composition capable of forming a coating layer having excellent transparency and heat radiating properties. The transparent heat radiating coating composition of the present invention is a transparent heat radiating coating composition including a binder resin, a hydrotalcite-series compound and a resin dispersant with an amine value of 0 to 90 mgKOH/g, wherein the transparent heat radiating coating composition includes 50 to 290 parts by weight of the hydrotalcite-series compound based on 100 parts by weight of the binder resin.Type: GrantFiled: January 14, 2011Date of Patent: September 2, 2014Assignees: Godo Printing Ink Mfg. Co., Ltd., Osaka Municipal Technical Research InsitituteInventors: Yasuyuki Agari, Akira Miyoshi, Ryohei Tsuboi
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Publication number: 20130072617Abstract: The present invention provides a transparent heat radiating coating composition capable of forming a coating layer having excellent transparency and heat radiating properties. The transparent heat radiating coating composition of the present invention is a transparent heat radiating coating composition including a binder resin, a hydrotalcite-series compound and a resin dispersant with an amine value of 0 to 90 mgKOH/g, wherein the transparent heat radiating coating composition includes 50 to 290 parts by weight of the hydrotalcite-series compound based on 100 parts by weight of the binder resin.Type: ApplicationFiled: January 14, 2011Publication date: March 21, 2013Applicants: OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE, GODO PRINTING INK MFG. CO., LTD.Inventors: Yasuyuki Agari, Akira Miyoshi, Ryohei Tsuboi
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Patent number: 6995205Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.Type: GrantFiled: August 27, 2002Date of Patent: February 7, 2006Assignees: Nippon Kagaku Yakin Co., Ltd., Osaka Municipal GovernmentInventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada
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Patent number: 6965001Abstract: According to the present invention, organic-inorganic hybrid polymer materials with compositional gradient, and processes for preparing the same are provided. In the organic-inorganic hybrid polymer materials with compositional gradient, formation of cracks, removal of surface, or deformation such as warp and distortion, under heat shock or upon aging, hardly occurs. The organic-inorganic hybrid polymer materials with compositional gradient are comprised of an organic polymer component and a metal oxide component which are covalently bonded each other, characterized in that concentration of the organic polymer component, or of the metal oxide component is increased or decreased in the direction of thickness of the material.Type: GrantFiled: December 14, 2001Date of Patent: November 15, 2005Assignees: Orient Chemical Industries, Ltd., Osaka Municipal GovernmentInventors: Motoomi Arakawa, Kazuaki Sukata, Yasuyuki Agari, Masayuki Shimada
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Publication number: 20050174880Abstract: Disclosed is a polymeric material obtained by melt-kneading, using a kneading machine, a resin composition which contains organic polymers having metal alkoxy groups. An organic-inorganic hybrid polymeric material which is suitable for use in high-performance and high-function polymeric materials, was provided.Type: ApplicationFiled: April 26, 2002Publication date: August 11, 2005Inventors: Manabu Shioyama, Masayuki Shimada, Yasuyuki Agari, Motoomi Arakawa, Kazuaki Sukata
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Patent number: 6818736Abstract: Disclosed is a polymeric material obtained by melt-kneading, using a kneading apparatus, a resin composition containing an organic polymer having no metal alkoxy group and a metal alkoxide compound. The organic-inorganic hybrid polymeric material, a polymeric material containing this component, and a molded products obtained therefrom are suitable for high-performance and high-function plastic applications. Simple and practical processes for producing them at high productivity and at low cast are also disclosed.Type: GrantFiled: June 14, 2002Date of Patent: November 16, 2004Assignees: Orient Chemical Industries, Ltd., Osaka Municipal GovernmentInventors: Manabu Shioyama, Masayuki Shimada, Yasuyuki Agari, Motoomi Arakawa, Kazuaki Sukata
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Publication number: 20040204526Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.Type: ApplicationFiled: March 25, 2004Publication date: October 14, 2004Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada
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Publication number: 20030045675Abstract: Disclosed is a polymeric material obtained by melt-kneading, using a kneading apparatus, a resin composition containing an organic polymer having no metal alkoxy group and a metal alkoxide compound. The organic-inorganic hybrid polymeric material, a polymeric material containing this component, and a molded products obtained therefrom are suitable for high-performance and high-function plastic applications. Simple and practical processes for producing them at high productivity and at low cast are also disclosed.Type: ApplicationFiled: June 14, 2002Publication date: March 6, 2003Inventors: Manabu Shioyama, Masayuki Shimada, Yasuyuki Agari, Motoomi Arakawa, Kazuaki Sukata