Patents by Inventor Yasuyuki AKASHI

Yasuyuki AKASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10250095
    Abstract: According to the present invention, a wire insulation layer (112) and an interlayer insulation layer (113) are formed on a wire (111). A main insulation layer (114) is formed by winding highly thermally conductive mica tape. A first outer insulation layer (115) formed from heat-shrinking material and a second outer insulation layer (116) formed from a highly thermally conductive resin are formed at a coil end section. Due to this configuration, the thermal conductivity of the coil, particularly of the coil end section, is improved, thereby enabling improved cooling performance.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: April 2, 2019
    Assignee: MEIDENSHA CORPORATION
    Inventors: Yasuyuki Akashi, Taemi Tadokoro
  • Publication number: 20180054104
    Abstract: According to the present invention, a wire insulation layer (112) and an interlayer insulation layer (113) are formed on a wire (111). A main insulation layer (114) is formed by winding highly thermally conductive mica tape. A first outer insulation layer (115) formed from heat-shrinking material and a second outer insulation layer (116) formed from a highly thermally conductive resin are formed at a coil end section. Due to this configuration, the thermal conductivity of the coil, particularly of the coil end section, is improved, thereby enabling improved cooling performance.
    Type: Application
    Filed: March 2, 2016
    Publication date: February 22, 2018
    Applicant: MEIDENSHA CORPORATION
    Inventors: Yasuyuki AKASHI, Taemi TADOKORO