Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.

Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.

Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.

Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.

Abstract: A lenses unit for an endoscope includes a lens barrel; a lens serving as a front group lens and lenses serving as a rear group lens, which are housed inside the lens barrel; and an aperture arranged between the front group lens and the rear group lens. An imaging-side final surface of the rear group lens has a structure in which the imaging-side final surface is fixed to a cover glass of an image pickup device with an adhesive layer. A focal distance fF of the front group lens, a focal distance fB of the rear group lens, a focal distance fel of an entire optical lenses group, a total optical length OL of the optical lenses group, and a metal back MB of the optical lenses group satisfy a relationship of fel/fF<0, fel/fB>0, and OL/MB>7.0.

Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.

Abstract: To provide a highly workable diffractive optical element which realizes a high refractive index and a low wavelength dispersiveness well balanced with each other and which exhibits high heat resistance and high endurance against temperature changes, a diffractive optical element includes a base member including a diffraction grating formed on a surface thereof and a protective film provided on the surface of the base member where the diffraction grating is formed, wherein the base member is composed of a silsesquioxane resin material or a dendrimer material which has a first refractive index and a first Abbe number and wherein the protective film is composed of a silicone resin material which has a second refractive index smaller than the first refractive index and a second Abbe number smaller than the first Abbe number.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: There is provided a fixing apparatus capable of reducing the warm-up time, improving the heating efficiency, and suppressing the temperature increase out of the sheet width by using a magnetic adjuster. In this apparatus, the Currie temperature Tc of the magnetic adjuster material heated by electromagnetic induction is set to 220 degrees C. or below and the fixation setting temperature of a heating member corresponding to the portion where a recording material passes during continuous sheet feed is set lower than a value than the temperature at which the relative magnetic permeability of the magnetic adjuster material begins to decrease. Thus, it is possible to obtain a large difference between the heating portion and the non-heating portion, to surely prevent excessive temperature increase of the portion out of the recording material width, to reduce the warm-up time, and improve the heating efficiency.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.

Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.