Patents by Inventor Yasuyuki Hanada

Yasuyuki Hanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190285868
    Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.
    Type: Application
    Filed: June 5, 2019
    Publication date: September 19, 2019
    Inventors: Naoyuki HARAGUCHI, Takafumi SANADA, Yasuyuki HANADA, Yuichi HATASE
  • Patent number: 10368727
    Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 6, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Akinori Osada, Takafumi Sanada, Yasuyuki Hanada, Naoyuki Haraguchi, Takahisa Suzuki, Tooru Tanaka, Hiroshi Nagayasu
  • Patent number: 10359619
    Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: July 23, 2019
    Assignee: PANASONIC CORPORATION
    Inventors: Naoyuki Haraguchi, Takafumi Sanada, Yasuyuki Hanada, Yuichi Hatase
  • Publication number: 20180059399
    Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.
    Type: Application
    Filed: October 24, 2017
    Publication date: March 1, 2018
    Inventors: Naoyuki HARAGUCHI, Takafumi SANADA, Yasuyuki HANADA, Yuichi HATASE
  • Publication number: 20170367565
    Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.
    Type: Application
    Filed: August 15, 2017
    Publication date: December 28, 2017
    Inventors: Akinori OSADA, Takafumi SANADA, Yasuyuki HANADA, Naoyuki HARAGUCHI, Takahisa SUZUKI, Tooru TANAKA, Hiroshi NAGAYASU
  • Patent number: 9829698
    Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: November 28, 2017
    Assignee: PANASONIC CORPORATION
    Inventors: Naoyuki Haraguchi, Takafumi Sanada, Yasuyuki Hanada, Yuichi Hatase
  • Patent number: 9826890
    Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: November 28, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Akinori Osada, Takafumi Sanada, Yasuyuki Hanada, Naoyuki Haraguchi, Takahisa Suzuki, Tooru Tanaka, Hiroshi Nagayasu
  • Publication number: 20170059848
    Abstract: An endoscope includes a single lens that has a square exterior shape in a direction perpendicular to an optical axis, an image sensor that has an square exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis, a sensor cover that has an exterior shape which is same as the exterior shape of the single lens, in the direction perpendicular to the optical axis; and a bonding resin portion that fixes the sensor cover to the single lens, The single lens is a lens which is formed in a prismatic shape. The single lens has first surface on an imaging subject side that has a plane, and has second surface on an imaging side that has a convex surface.
    Type: Application
    Filed: August 18, 2016
    Publication date: March 2, 2017
    Inventors: Naoyuki HARAGUCHI, Takafumi SANADA, Yasuyuki HANADA, Yuichi HATASE
  • Publication number: 20160178884
    Abstract: A lenses unit for an endoscope includes a lens barrel; a lens serving as a front group lens and lenses serving as a rear group lens, which are housed inside the lens barrel; and an aperture arranged between the front group lens and the rear group lens. An imaging-side final surface of the rear group lens has a structure in which the imaging-side final surface is fixed to a cover glass of an image pickup device with an adhesive layer. A focal distance fF of the front group lens, a focal distance fB of the rear group lens, a focal distance fel of an entire optical lenses group, a total optical length OL of the optical lenses group, and a metal back MB of the optical lenses group satisfy a relationship of fel/fF<0, fel/fB>0, and OL/MB>7.0.
    Type: Application
    Filed: October 29, 2015
    Publication date: June 23, 2016
    Inventors: Yasuyuki Hanada, Saturo Miyanishi, Akinori Osada, Yoshio Matsumura
  • Publication number: 20150238069
    Abstract: An endoscope which promotes downsizing and cost reduction, and a manufacturing method of an endoscope are provided. For this reason, in an endoscope, a lens unit containing a lens in a lens tube, an image capturing element of which an image capturing surface is covered with element cover glass, and an adhesive resin fixing the lens unit of which an optical axis of the lens is coincident with the center of the image capturing surface to the element cover glass with a separation portion are disposed.
    Type: Application
    Filed: February 18, 2015
    Publication date: August 27, 2015
    Inventors: Akinori Osada, Takafumi Sanada, Yasuyuki Hanada, Naoyuki Haraguchi, Takahisa Suzuki, Tooru Tanaka, Hiroshi Nagayasu
  • Publication number: 20140313584
    Abstract: To provide a highly workable diffractive optical element which realizes a high refractive index and a low wavelength dispersiveness well balanced with each other and which exhibits high heat resistance and high endurance against temperature changes, a diffractive optical element includes a base member including a diffraction grating formed on a surface thereof and a protective film provided on the surface of the base member where the diffraction grating is formed, wherein the base member is composed of a silsesquioxane resin material or a dendrimer material which has a first refractive index and a first Abbe number and wherein the protective film is composed of a silicone resin material which has a second refractive index smaller than the first refractive index and a second Abbe number smaller than the first Abbe number.
    Type: Application
    Filed: October 30, 2012
    Publication date: October 23, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Yasuyuki Hanada, Tsuguhiro Korenaga, Yuka Okada
  • Patent number: 7772769
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: August 10, 2010
    Assignee: Panasonic Corporation
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Patent number: 7629620
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: December 8, 2009
    Assignee: Panasonic Corporation
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Patent number: 7592639
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Grant
    Filed: October 25, 2006
    Date of Patent: September 22, 2009
    Assignee: Panasonic Corporation
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Publication number: 20090028617
    Abstract: There is provided a fixing apparatus capable of reducing the warm-up time, improving the heating efficiency, and suppressing the temperature increase out of the sheet width by using a magnetic adjuster. In this apparatus, the Currie temperature Tc of the magnetic adjuster material heated by electromagnetic induction is set to 220 degrees C. or below and the fixation setting temperature of a heating member corresponding to the portion where a recording material passes during continuous sheet feed is set lower than a value than the temperature at which the relative magnetic permeability of the magnetic adjuster material begins to decrease. Thus, it is possible to obtain a large difference between the heating portion and the non-heating portion, to surely prevent excessive temperature increase of the portion out of the recording material width, to reduce the warm-up time, and improve the heating efficiency.
    Type: Application
    Filed: March 13, 2006
    Publication date: January 29, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Noboru Katakabe, Naoto Matsuo, Satoru Miyanishi, Yasuyuki Hanada, Masaru Imai, Hideki Tatematsu, Shigemitsu Tani
  • Patent number: 7422504
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: September 9, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Publication number: 20080135862
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Application
    Filed: October 19, 2007
    Publication date: June 12, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Publication number: 20070046169
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Application
    Filed: October 25, 2006
    Publication date: March 1, 2007
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Publication number: 20060124942
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Application
    Filed: February 9, 2006
    Publication date: June 15, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Hidenori Kamei, Yasuyuki Hanada, Kei Sakanoue
  • Patent number: RE47453
    Abstract: A chip-type light-emitting semiconductor device includes: a substrate 4; a blue LED 1 mounted on the substrate 4; and a luminescent layer 3 made of a mixture of yellow/yellowish phosphor particles 2 and a base material 13 (translucent resin). The yellow/yellowish phosphor particles 2 is a silicate phosphor which absorbs blue light emitted by the blue LED 1 to emit a fluorescence having a main emission peak in the wavelength range from 550 nm to 600 nm, inclusive, and which contains, as a main component, a compound expressed by the chemical formula: (Sr1-a1-b1-xBaa1Cab1Eux)2SiO4 (0?a1?0.3, 0?b1?0.8 and 0<x<1). The silicate phosphor particles disperse substantially evenly in the resin easily. As a result, excellent white light is obtained.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: June 25, 2019
    Assignee: Panasonic Corporation
    Inventors: Toshihide Maeda, Shozo Oshio, Katsuaki Iwama, Hiromi Kitahara, Tadaaki Ikeda, Kei Sakanoue, Hidenori Kamei, Yasuyuki Hanada