Abstract: A substrate stage includes: a stage body having a substrate placing surface on which a substrate is placed in a processing apparatus that performs a processing on the substrate; and a thermocouple configured to detect a temperature near the substrate placing surface of the stage body. The thermocouple includes a temperature measuring unit formed by stacking a first metal film and a second metal film, on a surface on a side of the substrate placing surface of the stage body.

Abstract: There is a substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the method comprising, locating a lift pin to a substrate transfer position over the placing surface, the lift pin being capable of protruding from and retracting below the placing surface, and transferring the substrate onto the lift pin; lowering the lift pin, on which the substrate is placed, to a substrate placing position lower than the placing surface; and raising the lift pin by a short distance and then returning the lift pin to the substrate placing position.

Abstract: There is provided a stage mechanism, including: an electrostatic chuck having a conductive film formed on a front surface thereof, the conductive film configured to make electrically contact with a rear surface of a substrate; a conductive member electrically connected to the conductive film and formed to extend to a rear surface of the electrostatic chuck; and a moving member electrically connected to the conductive member via a connecting member and configured to move between a first position connected to a ground potential and a second position not connected to the ground potential.

Abstract: A substrate stage includes: a stage body having a substrate placing surface on which a substrate is placed in a processing apparatus that performs a processing on the substrate; and a thermocouple configured to detect a temperature near the substrate placing surface of the stage body. The thermocouple includes a temperature measuring unit formed by stacking a first metal film and a second metal film, on a surface on a side of the substrate placing surface of the stage body.

Abstract: There is provided a stage mechanism, including: an electrostatic chuck having a conductive film formed on a front surface thereof, the conductive film configured to make electrically contact with a rear surface of a substrate; a conductive member electrically connected to the conductive film and formed to extend to a rear surface of the electrostatic chuck; and a moving member electrically connected to the conductive member via a connecting member and configured to move between a first position connected to a ground potential and a second position not connected to the ground potential.