Abstract: A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

Abstract: A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Abstract: [Object] Provided are a 11C-labeled acyclic retinoid that can be synthesized in a short time with a high yield and can be suitably used for PET for elucidating intracerebral kinetics, a PET probe using it, and methods for producing them. [Solution] The 11C-labeled acyclic retinoid of the present invention is characterized by being represented by the following chemical formula (a). This compound can be produced by a coupling step of cross-coupling a methyl iodide labelled with 11C and the following organotin compound (b) (provided that in the formula, R1 and R2 represent alkyl groups which may have a branch) in an aprotic solvent in the presence of a palladium complex, a phosphine ligand, and a cuprous halide.

Abstract: A stator includes a stator core having a plurality of slots, and a plurality of segment coils, each of which has an insulating film, the plurality of segment coils each including an inclined portion and a rising portion. the rising portions that are adjacent to each other in a radial direction of the stator core being joined to each other. Each of the plurality of segment coils includes first peeled portions each in which the insulating film facing the circumferential direction of the stator core is peeled in a lengthwise direction, and second peeled portions each in which the insulating film facing the radial direction of the stator core is peeled in the lengthwise direction, and a peeling length of the first peeled portion is longer than a peeling length of the second peeled portion.

Abstract: The disclosure provides a tube which is rarely broken and is stable during the process of the production of a heat-shrinkable tube having tearability in a length direction. The tube includes a melt-processable fluororesin and when the strain of the tube is defined as ?, the stress at the strain is defined as ? (MPa) and the strain ? is put on the horizontal axis and the stress ? is put on the longitudinal axis on a coordinate graph, each of a straight line ab and a straight line cd which are defined by four coordinate points a (0.4,8.8), b(0.4,2.4), c(1.0,9.9) and d(1.0,3.2) on the graph intersects with a mechanical property curve of the tube which is obtained by carrying out a tensile test under the conditions of an ambient temperature of 60° C., an initial chuck-to-chuck distance of 22±0.05 mm and a tensile speed of 5 mm/sec.

Abstract: A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.

Abstract: A header for a semiconductor package, includes an eyelet having an upper surface, and a lower surface on an opposite side from the upper surface, a metal block having a side surface, and configured to protrude from the upper surface of the eyelet, a lead sealed in a through hole which penetrates the eyelet from the upper surface to the lower surface of the eyelet, and a substrate having a front surface formed with a signal pattern electrically connected to the lead, and a back surface on an opposite side from the front surface. The back surface of the substrate is fixed to the side surface of the metal block. A portion of the back surface of the substrate is exposed from the metal block, and this portion of the substrate is formed with a ground pattern.

Abstract: A header for a semiconductor package includes: an eyelet having an upper surface and a lower surface; a first metal block molded integrally with the eyelet, protruding at the upper surface, and having a substantially U shape; a first lead sealed in a first through hole penetrating the eyelet; a first substrate having a front surface formed with a first signal pattern electrically connected to the first lead and having a back surface fixed to a first end surface of the first metal block; a second lead sealed in a second through hole penetrating the eyelet; and a second substrate having a front surface formed with a second signal pattern electrically connected to the second lead and having a back surface fixed to a second end surface of the first metal block.

Abstract: A hollow portion is formed in a holding jig. A first projection protrudes from a first inner side wall of the hollow portion. As the holding jig rotates to twist and bend a leg portion of a conductor, the projection bites into the leg portion.

Abstract: A conductive-wire position inspecting device includes: a reference body disposed in a radial direction of a stator core; an imaging device configured to image a conductive wire and the reference body; and a calculating device configured to find a relative position and a relative angle of the conductive wire with respect to the reference body, based on an obtained image. In addition, the conductive-wire position inspecting device includes a determining device configured to determine whether or not the found relative position and relative angle are within respective permissible ranges, and if they are within the permissible ranges, determine the position of the conductive wire to be acceptable.

Abstract: A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

Abstract: A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.

Abstract: A stem has a stem body that has a first surface to be placed on a flexible substrate, a second surface opposite to the first surface, and a through hole passing through the first surface and the second surface, a cylindrical body that is fitted into the through hole of the stem body, and a lead that is inserted into the cylindrical body and fixed to the cylindrical body with a fixing member and that has an end portion protruding from the first surface of the stem body. The cylindrical body has a protrusion that protrudes toward the flexible substrate from the first surface of the stem body and surrounds an outer circumferential surface of the end portion of the lead.

Abstract: A conductive-wire position inspecting device includes: a reference body disposed in a radial direction of a stator core; an imaging device configured to image a conductive wire and the reference body; and a calculating device configured to find a relative position and a relative angle of the conductive wire with respect to the reference body, based on an obtained image. In addition, the conductive-wire position inspecting device includes a determining device configured to determine whether or not the found relative position and relative angle are within respective permissible ranges, and if they are within the permissible ranges, determine the position of the conductive wire to be acceptable.

Abstract: A conductive-wire position inspecting device includes: a reference body disposed in a radial direction of a stator core; an imaging device configured to image a conductive wire and the reference body; and a calculating device configured to find a relative position and a relative angle of the conductive wire with respect to the reference body, based on an obtained image. In addition, the conductive-wire position inspecting device includes a determining device configured to determine whether or not the found relative position and relative angle are within respective permissible ranges, and if they are within the permissible ranges, determine the position of the conductive wire to be acceptable.

Abstract: A manufacturing method for a rotating electric machine, in which the distal end portions of a plurality of coil ends, which are projected from slots of a stator core of a rotating electric machine and which are arranged in the radial direction of the stator core to form a plurality of layers, are held, and the coil ends are twisted and bent while moving the distal end portions in the circumferential direction. Neutral lines for bending the coil ends are different for each layer, and the neutral lines for the bending are positioned on farther outer sides for coil ends of farther outer layers.

Abstract: A hollow portion is formed in a holding jig. A first projection protrudes from a first inner side wall of the hollow portion. As the holding jig rotates to twist and bend a leg portion of a conductor, the projection bites into the leg portion.

Abstract: An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.

Abstract: A conductive-wire position inspecting device includes: a reference body disposed in a radial direction of a stator core; an imaging device configured to image a conductive wire and the reference body; and a calculating device configured to find a relative position and a relative angle of the conductive wire with respect to the reference body, based on an obtained image. In addition, the conductive-wire position inspecting device includes a determining device configured to determine whether or not the found relative position and relative angle are within respective permissible ranges, and if they are within the permissible ranges, determine the position of the conductive wire to be acceptable.

Abstract: An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal portion inserted into and fixed to the base. An optical element is mounted on the sub-mount. The bottom wall of the base includes a first seat to which the sub-mount is fixed and a second seat to which the distal portion is fixed. The second seat is located at a higher position than the first seat. An upper surface of the distal portion of the wiring substrate includes a pad connected to the optical element. An upper surface of the pad of the distal portion is flush with an upper surface of an electrode of the optical element.