Patents by Inventor Yasuyuki Koshikawa

Yasuyuki Koshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board
    Patent number: 10085336
    Abstract: A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: September 25, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masahiro Katou, Yasuyuki Koshikawa, Hiroshi Wada
  • MULTILAYER WIRING BOARD
    Publication number: 20150136447
    Abstract: A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.
    Type: Application
    Filed: May 9, 2013
    Publication date: May 21, 2015
    Inventors: Masahiro Katou, Yasuyuki Koshikawa, Hiroshi Wada