Patents by Inventor Yasuyuki Motoshima
Yasuyuki Motoshima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170239778Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.Type: ApplicationFiled: February 17, 2017Publication date: August 24, 2017Applicant: Ebara CorporationInventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA, Yohei ETO, Mitsunori KOMATSU
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Publication number: 20170106492Abstract: Disclosed is a polishing apparatus that polishes a substrate by causing the substrate to be in slide contact with a polishing pad. The polishing apparatus includes a pad temperature control mechanism configured to control a surface temperature of the polishing pad, which includes a pad contact member that comes in contact with the surface of the polishing pad and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact member. The pad contact member includes a liquid flow path therein, and the liquid flow path communicates with a liquid inlet and a liquid outlet connected to the liquid supply system. At least one planar baffle is disposed in the liquid flow path, and the baffle has a space therein.Type: ApplicationFiled: October 19, 2016Publication date: April 20, 2017Inventor: Yasuyuki Motoshima
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Patent number: 9579768Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.Type: GrantFiled: July 13, 2012Date of Patent: February 28, 2017Assignee: EBARA CORPORATIONInventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
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Patent number: 9561575Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.Type: GrantFiled: December 9, 2015Date of Patent: February 7, 2017Assignee: Ebara CorporationInventors: Yasuyuki Motoshima, Toru Maruyama
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Patent number: 9475167Abstract: A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.Type: GrantFiled: February 16, 2012Date of Patent: October 25, 2016Assignee: Ebara CorporationInventors: Toru Maruyama, Tadakazu Sone, Yasuyuki Motoshima
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Publication number: 20160264365Abstract: A substrate transfer hand is configured to sandwich a substrate between a plurality of receiving members and a gripping member and to fix the substrate by moving the gripping member with an actuator. The plurality of receiving members each have a flat plate-shaped support portion mounted on the main hand body, a substrate outer periphery holding portion supported on the support portion and configured to hold an outer periphery of the substrate, and a substrate lower surface holding portion supported on the support portion and configured to hold a lower surface of the substrate. The substrate outer periphery holding portion has a portion provided vertically from the support portion and configured to hold the substrate in contact with the outer periphery of the substrate. The substrate lower surface holding portion has a portion inclined from an outer peripheral side toward an inner side of the substrate to be held.Type: ApplicationFiled: March 7, 2016Publication date: September 15, 2016Inventors: Toru Maruyama, Yasuyuki Motoshima, Yohei Eto
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Publication number: 20160096250Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.Type: ApplicationFiled: December 9, 2015Publication date: April 7, 2016Inventors: Yasuyuki MOTOSHIMA, Toru MARUYAMA
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Patent number: 9233448Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.Type: GrantFiled: September 23, 2013Date of Patent: January 12, 2016Assignee: Ebara CorporationInventors: Yasuyuki Motoshima, Toru Maruyama
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Publication number: 20150224621Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.Type: ApplicationFiled: April 27, 2015Publication date: August 13, 2015Inventors: Yasuyuki MOTOSHIMA, Toru MARUYAMA, Hisanori MATSUO
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Publication number: 20150079881Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.Type: ApplicationFiled: August 21, 2014Publication date: March 19, 2015Inventors: Toru MARUYAMA, Hisanori MATSUO, Yasuyuki MOTOSHIMA
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Publication number: 20140364040Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.Type: ApplicationFiled: August 26, 2014Publication date: December 11, 2014Inventors: Tadakazu SONE, Yasuyuki MOTOSHIMA, Toru MARUYAMA, Katsutoshi ONO, Yoichi SHIOKAWA
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Patent number: 8845391Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.Type: GrantFiled: December 21, 2010Date of Patent: September 30, 2014Assignee: Ebara CorporationInventors: Tadakazu Sone, Yasuyuki Motoshima, Toru Maruyama, Katsutoshi Ono, Yoichi Shiokawa
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Patent number: 8777198Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: February 16, 2012Date of Patent: July 15, 2014Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Publication number: 20140127973Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.Type: ApplicationFiled: September 23, 2013Publication date: May 8, 2014Inventors: Yasuyuki MOTOSHIMA, Toru MARUYAMA
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Publication number: 20130023186Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.Type: ApplicationFiled: July 13, 2012Publication date: January 24, 2013Inventors: Yasuyuki MOTOSHIMA, Toru Maruyama, Hisanori Matsuo
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Publication number: 20120220196Abstract: A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.Type: ApplicationFiled: February 16, 2012Publication date: August 30, 2012Applicant: EBARA CORPORATIONInventors: Toru MARUYAMA, Tadakazu Sone, Yasuyuki Motoshima
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Publication number: 20120141246Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: ApplicationFiled: February 16, 2012Publication date: June 7, 2012Inventors: Masahiko SEKIMOTO, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Patent number: 8141513Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: January 3, 2011Date of Patent: March 27, 2012Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
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Publication number: 20110159782Abstract: An apparatus for polishing a substrate is provided. The apparatus includes: a rotatable polishing table supporting a polishing pad; a substrate holder configured to hold a substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate; a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad; a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface; and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.Type: ApplicationFiled: December 21, 2010Publication date: June 30, 2011Inventors: Tadakazu SONE, Yasuyuki MOTOSHIMA, Toru MARUYAMA, Katsutoshi ONO, Yoichi SHIOKAWA
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Publication number: 20110094442Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: ApplicationFiled: January 3, 2011Publication date: April 28, 2011Inventors: Masahiko SEKIMOTO, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato