Patents by Inventor Yasuyuki NURIYA

Yasuyuki NURIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inspection device and inspection method
    Patent number: 11971367
    Abstract: An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: April 30, 2024
    Assignee: JUKI CORPORATION
    Inventor: Yasuyuki Nuriya
  • Inspection device and inspection method
    Patent number: 11733180
    Abstract: An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: August 22, 2023
    Assignee: JUKI CORPORATION
    Inventor: Yasuyuki Nuriya
  • INSPECTION DEVICE AND INSPECTION METHOD
    Publication number: 20210172884
    Abstract: An inspection device includes an image acquisition unit configured to acquire images obtained by imaging, under at least two illumination conditions with different brightness, solder normally printed on a substrate, and an image processing unit configured to specify a shape of the solder based on a difference in brightness between the images acquired by the image acquisition unit, and generate, based on the shape of the solder, inspection data used for inspecting a state of the solder printed on the substrate.
    Type: Application
    Filed: December 1, 2020
    Publication date: June 10, 2021
    Applicant: JUKI CORPORATION
    Inventor: Yasuyuki NURIYA