Patents by Inventor Yasuyuki Oi

Yasuyuki Oi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9437522
    Abstract: A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3. Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: September 6, 2016
    Assignee: CALSONIC KANSEI CORPORATION
    Inventors: Toshikazu Yoshihara, Satoshi Tamagawa, Yasuyuki Oi, Hideki Kobayashi
  • Publication number: 20140225249
    Abstract: A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3 . Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3.
    Type: Application
    Filed: April 27, 2012
    Publication date: August 14, 2014
    Applicant: Calsonic Kansei Corporation
    Inventors: Toshikazu Yoshihara, Satoshi Tamagawa, Yasuyuki Oi, Hideki Kobayashi