Abstract: The wire harness 11 disclosed by the present specification includes: a sheet-shaped base member 12; and a plurality of covered electric wires W fixed side by side along the base member 12, in which the transverse cross-sectional area of at least one of the plurality of covered electric wires W is different from the transverse cross-sectional area of another covered electric wire W, and the thickness of the covered electric wire W is substantially the same as the thickness of the covered electric wire W adjacent thereto.

Abstract: A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.

Abstract: A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.

Abstract: A thin sheet type heat pipe is disclosed. The heat pipe may include a hermetically sealed container that is formed of foil sheets opposed and jointed at peripheral portions. The heat pipe may further include at least one spacer including a sheet having a fluid path and exerting a capillary force, which is movably housed in the container without bonding between the spacer and the container for maintaining flexibility to allow the container to be bent smoothly. The heat pipe may also include a working fluid enclosed in the container.

Abstract: The present invention has proposed a thin sheet type heat pipe comprising: a hermetically sealed container which is formed of foil sheets opposed and jointed at peripheral portions; at least one spacer which is movably housed in said container and has a fluid path to exert a capillary force; at least one spacer which is movably housed in said container and has no fluid path; and a working fluid enclosed in said container.

Abstract: The present invention has proposed a thin sheet type heat pipe comprising: a hermetically sealed container which is formed of foil sheets opposed and jointed at peripheral portions; at least one spacer which is movably housed in said container and has a fluid path to exert a capillary force; at least one spacer which is movably housed in said container and has no fluid path; and a working fluid enclosed in said container.