Patents by Inventor Yasuyuki SEKIMOTO
Yasuyuki SEKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10522289Abstract: An electronic component includes a component main body including an embedded internal conductor and an outer electrode. The component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface. The outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface. At least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer, and at least a portion of an exposed surface of the end surface covering portion includes a Sn—Ni layer.Type: GrantFiled: March 11, 2016Date of Patent: December 31, 2019Assignee: MURATA & MANUFACTURING CO., LTD.Inventors: Shinichiro Kuroiwa, Kazuo Hattori, Isamu Fujimoto, Yasuyuki Sekimoto
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Patent number: 10111325Abstract: An elastic conductor includes a stretchable base, and conductors each having a longitudinal shape, being arranged on a surface of the stretchable base, and having a lower specific resistance and a higher modulus of elasticity than the stretchable base. In the first state, the conductors are spaced apart from each other in the second direction perpendicular or substantially perpendicular to the first direction, and are continuous in a section extending in the first direction as seen in the second direction from one end of the section to the other end of the section, in which a distance between the conductors adjacent to each other in the second direction in the second state is shorter than a distance between the conductors adjacent to each other in the second direction in the first state.Type: GrantFiled: February 12, 2018Date of Patent: October 23, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Yasuyuki Sekimoto
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Patent number: 10090268Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.Type: GrantFiled: July 27, 2015Date of Patent: October 2, 2018Assignees: MURATA MANUFACTURING CO., LTD., SENJU METAL INDUSTRY CO., LTD.Inventors: Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
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Publication number: 20180168028Abstract: An elastic conductor includes a stretchable base, and conductors each having a longitudinal shape, being arranged on a surface of the stretchable base, and having a lower specific resistance and a higher modulus of elasticity than the stretchable base. In the first state, the conductors are spaced apart from each other in the second direction perpendicular or substantially perpendicular to the first direction, and are continuous in a section extending in the first direction as seen in the second direction from one end of the section to the other end of the section, in which a distance between the conductors adjacent to each other in the second direction in the second state is shorter than a distance between the conductors adjacent to each other in the second direction in the first state.Type: ApplicationFiled: February 12, 2018Publication date: June 14, 2018Inventor: Yasuyuki SEKIMOTO
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Publication number: 20160276106Abstract: An electronic component includes a component main body including an embedded internal conductor and an outer electrode. The component main body includes an end surface on which the internal conductor is exposed, and a main surface that is continuous with the end surface and intersects with the end surface. The outer electrode includes an end surface covering portion connected to the internal conductor by covering at least a portion of the internal conductor exposed on the end surface, and a main surface covering portion that covers at least a portion of the main surface. At least a portion of an exposed surface of the main surface covering portion includes a Sn plating layer, and at least a portion of an exposed surface of the end surface covering portion includes a Sn—Ni layer.Type: ApplicationFiled: March 11, 2016Publication date: September 22, 2016Inventors: Shinichiro KUROIWA, Kazuo HATTORI, Isamu FUJIMOTO, Yasuyuki SEKIMOTO
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Publication number: 20150333027Abstract: A solder bump formed on an Ni electrode with the use of a solder ball containing Bi as a main component and Sn as a sub component. The solder ball contains Sn from 1.0 to 10.0 mass % and at most 1.0 mass % of at least one of Cu and Ag. A solder joint portion obtained by use of the solder bump has at least one of Sn and an SnBi eutectic alloy.Type: ApplicationFiled: July 27, 2015Publication date: November 19, 2015Inventors: Yasuyuki Sekimoto, Hidekiyo Takaoka, Shigeo Nishimura, Minoru Ueshima, Tohru Kurushima
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Patent number: 8794499Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.Type: GrantFiled: November 29, 2011Date of Patent: August 5, 2014Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasuyuki Sekimoto
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Patent number: 8570763Abstract: A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.Type: GrantFiled: December 28, 2009Date of Patent: October 29, 2013Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasuyuki Sekimoto
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Patent number: 8419884Abstract: A method for manufacturing a multilayer wiring substrate processes a via hole without unnecessarily increasing the diameter thereof and which can easily achieve the formation of fine wiring. A first resin layer in a cured state is prepared in which at least one first via hole including a bottom made of a conductive pattern is formed by laser processing, a second resin layer in an uncured state is prepared in which at least one second via hole is formed to penetrate therethrough at a position corresponding to the first via hole, and the first resin layer and the second resin layer are laminated to each other so that the first via hole and the second via hole communicate with each other. After a conductive paste is simultaneously filled in the first via hole and the second via hole, a metal foil is pressure-bonded to the second resin layer, and the second resin layer and the conductive paste are simultaneously cured. Subsequently, the metal foil is patterned.Type: GrantFiled: June 11, 2010Date of Patent: April 16, 2013Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasuyuki Sekimoto
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Publication number: 20120321814Abstract: A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.Type: ApplicationFiled: August 29, 2012Publication date: December 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Yasuyuki SEKIMOTO
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Publication number: 20120298728Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.Type: ApplicationFiled: November 29, 2011Publication date: November 29, 2012Applicant: Murata Manufacturing Co., Ltd.Inventor: Yasuyuki SEKIMOTO
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Publication number: 20100236698Abstract: A method for manufacturing a multilayer wiring substrate processes a via hole without unnecessarily increasing the diameter thereof and which can easily achieve the formation of fine wiring. A first resin layer in a cured state is prepared in which at least one first via hole including a bottom made of a conductive pattern is formed by laser processing, a second resin layer in an uncured state is prepared in which at least one second via hole is formed to penetrate therethrough at a position corresponding to the first via hole, and the first resin layer and the second resin layer are laminated to each other so that the first via hole and the second via hole communicate with each other. After a conductive paste is simultaneously filled in the first via hole and the second via hole, a metal foil is pressure-bonded to the second resin layer, and the second resin layer and the conductive paste are simultaneously cured. Subsequently, the metal foil is patterned.Type: ApplicationFiled: June 11, 2010Publication date: September 23, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Yasuyuki SEKIMOTO
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Publication number: 20100101836Abstract: A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.Type: ApplicationFiled: December 28, 2009Publication date: April 29, 2010Applicant: Murata Manufacturing Co., Ltd.Inventor: Yasuyuki SEKIMOTO