Patents by Inventor Yasuyuki Shiga
Yasuyuki Shiga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862652Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: November 21, 2022Date of Patent: January 2, 2024Assignee: SONY GROUP CORPORATIONInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20230411424Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: August 21, 2023Publication date: December 21, 2023Applicant: Sony Group CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20230261022Abstract: A solid-state imaging device as disclosed includes a plurality of photoelectric conversion units, a pair of voltage application units, a charge detection unit, and a pixel separation unit. The photoelectric conversion units are in a semiconductor layer The pair of voltage application units are on the opposite side of the semiconductor layer from a light incident surface side. The charge detection unit annularly surrounds each of the voltage application units in plan view and detects the signal charges distributed according to alternate application of a predetermined voltage to the pair of voltage application units. The pixel separation unit partitions and separates the semiconductor layer for each of the photoelectric conversion units in plan view and extends in a depth direction of the semiconductor layer from the light incident surface. An insulating film having a film thickness of 2 nm or more is provided between the pixel separation unit and the semiconductor layer.Type: ApplicationFiled: July 8, 2021Publication date: August 17, 2023Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Kunihiro KOMORI, Yasuyuki SHIGA, Shingo YAMAGUCHI
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Publication number: 20230081078Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: November 21, 2022Publication date: March 16, 2023Applicant: Sony Group CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 11557623Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: January 11, 2021Date of Patent: January 17, 2023Assignee: SONY CORPORATIONInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20210134858Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: January 11, 2021Publication date: May 6, 2021Applicant: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 10950644Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: September 11, 2019Date of Patent: March 16, 2021Assignee: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20200006411Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: September 11, 2019Publication date: January 2, 2020Applicant: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 10461110Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: January 8, 2018Date of Patent: October 29, 2019Assignee: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20180130835Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: January 8, 2018Publication date: May 10, 2018Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 9893105Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: October 20, 2016Date of Patent: February 13, 2018Assignee: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20170040359Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: October 20, 2016Publication date: February 9, 2017Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 9502454Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: March 24, 2016Date of Patent: November 22, 2016Assignee: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20160204145Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: March 24, 2016Publication date: July 14, 2016Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 9337226Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: GrantFiled: September 19, 2014Date of Patent: May 10, 2016Assignee: Sony CorporationInventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Publication number: 20150091121Abstract: An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.Type: ApplicationFiled: September 19, 2014Publication date: April 2, 2015Inventors: Shuji Manda, Susumu Hiyama, Yasuyuki Shiga
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Patent number: 8759933Abstract: Disclosed herein is a solid-state image pickup element, including: a semiconductor substrate; a pixel portion which is formed on the semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion portion are arranged; an insulating layer formed on the semiconductor substrate so as to cover the photoelectric conversion portion; a hole portion formed in the insulating layer and above the photoelectric conversion portion; a silicon nitride layer formed so as to cover a bottom surface and a side surface of the hole portion; and a buried layer formed on the silicon nitride layer, wherein the silicon nitride layer is formed so as to contain a silicon nitride formed by utilizing an atomic layer deposition method.Type: GrantFiled: May 27, 2010Date of Patent: June 24, 2014Assignee: Sony CorporationInventors: Yoshinori Toumiya, Kiyotaka Tabuchi, Yasuyuki Shiga, Iwao Sugiura, Naoyuki Miyashita, Masanori Iwasaki, Katsunori Kokubun, Tomohiro Yamazaki
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Publication number: 20110024857Abstract: Disclosed herein is a solid-state image pickup element, including: a semiconductor substrate; a pixel portion which is formed on the semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion portion are arranged; an insulating layer formed on the semiconductor substrate so as to cover the photoelectric conversion portion; a hole portion formed in the insulating layer and above the photoelectric conversion portion; a silicon nitride layer formed so as to cover a bottom surface and a side surface of the hole portion; and a buried layer formed on the silicon nitride layer, wherein the silicon nitride layer is formed so as to contain a silicon nitride formed by utilizing an atomic layer deposition method.Type: ApplicationFiled: May 27, 2010Publication date: February 3, 2011Applicant: SONY CORPORATIONInventors: Yoshinori Toumiya, Kiyotaka Tabuchi, Yasuyuki Shiga, Iwao Sugiura, Naoyuki Miyashita, Masanori Iwasaki, Katsunori Kokubun, Tomohiro Yamazaki